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Suggested Items

Who Carries the Risk? A PCB Supply Chain Paradox

06/18/2026 | Jan Pedersen, Engineer and PCB Expert
For as long as I can remember, PCB customers have been encouraged to provide forecasts. Whether discussing standard multilayer boards, advanced HDI designs, or complex aerospace programs, the message has been remarkably consistent: Better visibility creates greater stability. The logic is difficult to dispute. When customers provide forecasts and scheduled orders, PCB manufacturers can plan capacity more effectively. Laminate suppliers can better predict future demand. Material allocation becomes easier, production schedules become more efficient, and the entire supply chain benefits from reduced uncertainty.

Kingboard Raises $1.5 Billion Through Kingboard Laminates Stake Sale to Support PCB Expansion

06/17/2026 | I-Connect007 Editorial Team
Kingboard Holdings has raised approximately HK$11.77 billion (US$1.5 billion) through the sale of a portion of its stake in subsidiary Kingboard Laminates Holdings, as growing demand from AI infrastructure drives investment across the PCB and electronics materials supply chain.

EPTAC: The ‘Ivy League’ of High-tech Training

06/17/2026 | Marcy LaRont, I-Connect007 Magazine
It’s been an exciting time for EPTAC, an IPC training and certification center based in Salem, New Hampshire, which recently opened a new state-of-the-art training facility to much fanfare. To help celebrate this accomplishment, we spoke with some key individuals who tell the story of what truly makes EPTAC successful. For over 35 years, EPTAC has built a reputation as a leading provider of IPC training and certification for the electronics manufacturing industry.

Smart Automation: When Traditional Depaneling Methods Reach Their Limits

06/16/2026 | Josh Casper -- Column: Smart Automation
PCB depaneling has traditionally been viewed as a relatively straightforward process in electronics manufacturing. Once the assembly process is complete, boards are separated from the panel and moved downstream for final assembly, test, or packaging. For years, manufacturers have relied on methods such as routing, V-score separation, and punch systems to handle this step efficiently and cost-effectively.

Marcy’s Musings: Old School vs. New School—When Does It Matter?

06/17/2026 | Marcy LaRont -- Column: Marcy's Musings
The battle between old and new is nothing new. Throughout history, technological progress has faced skepticism, resistance, and at times, outright hostility. Yet progress tends to win. In his book, "RenAIssance," author and APEX EXPO 2026 keynote Zack Kass illustrates this point beautifully. From hand weaving to sewing machines, from scribes to the printing press, from horse-drawn carriages to automobiles, and now to artificial intelligence, each technological leap has ultimately made our lives more productive and expanded what was possible.
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