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Advanced Electronics Packaging Digest

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SCHMID Group Announces Multiple Share Issuances for Liabilities and Compensation

05/26/2026 | SCHMID Group
SCHMID Group N.V., a global leader in providing solutions to the high-tech electronics, glass, and energy systems industries, provides an update on various share issuances resolved by its board of directors on May 23, 2026.

AT&S Expands Capacity for AI Substrates

05/21/2026 | AT&S
As increasingly more computing power is required in the field of artificial intelligence, demand by a key customer for high-end IC substrates of AT&S is growing.

TPCA Launches AI-Powered PCB GPT Knowledge Platform

05/15/2026 | TPCA
The Taiwan Printed Circuit Association (TPCA) has launched the "PCB GPT Industry Knowledge Platform," which uses generative AI to connect PCB professional knowledge services and help the industry improve the efficiency of cross-border and professional talent training.

Interlink Electronics Reports Q1 2026 Results

05/15/2026 | Globe Newswire
Revenue for the first quarter of 2026 increased 15% to $3.07 million, compared to $2.66 million in the first quarter of 2025. The increase was driven by higher shipments of the Company’s force-sensing and printed electronics products, partially offset by lower sales of its gas‑sensor products.

STARTEAM GLOBAL Achieves A Score in CDP’s Supplier Engagement Assessment

05/14/2026 | STARTEAM GLOBAL
STARTEAM GLOBAL has achieved an A score in CDP’s Supplier Engagement Assessment (SEA).
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