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Zhen Ding, Tsinghua University Launch Phase II R&D and Digital Transformation Program

04/30/2026 | Zhen Ding
Zhen Ding Technology Holding Limited, a global leader in the PCB industry, held the launch ceremony for the Phase II (2026-2030) Industry-Academia Collaboration Program of the Zhen Ding-Tsinghua Joint Research Center at the Zhen Ding Technology Lecture Hall on the Tsinghua University campus.

TPCA and Industry Leaders Convene in Bangkok for Thailand PCB Summit

04/30/2026 | TPCA
At a critical juncture of global supply chain restructuring and the explosive growth in demand for AI computing power, Thailand is becoming a crucial hub for the next wave of high-end manufacturing in the electronics and circuit industry.

A Designer's Focus on High Density

04/30/2026 | Marcy LaRont, I-Connect007 Magazine
Vern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.

Jiva Soluboard Getting the Attention It Deserves

04/30/2026 | Marcy LaRont, I-Connect007 Magazine
Jiva is a newer company that bridges the divide between PCB fabrication and product circularity or sustainability. Jiva Soluboard is the first fully recyclable laminate material ever created for PCB fabrication, and it's not going unnoticed. Stephen Driver, CEO of Jiva, gave us an update at APEX EXPO, including an exciting certification achievement in February.

OKI Develops 180-Layer, 15 mm PCB for AI Semiconductor Test Equipment

04/29/2026 | BUSINESS WIRE
OKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) mounted on AI semiconductors.
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