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MacDermid Alpha’s Affinity™ Flex Installation at Shenzhen Moker Marks Major Advancement for High-Reliability Flex PCB Manufacturing in China
March 31, 2026 | MacDermid AlphaEstimated reading time: 2 minutes
MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to support Shenzhen Moker with the installation of Affinity Flex. This deployment of a cyanide-free Electroless-Nickel-Immersion-Gold (ENIG) process represents an important advancement for flexible printed circuit board (FPCB) manufacturing in China.
This development strengthens the flex and rigid-flex PCB industry segment in the region, addressing reliability challenges while enabling fabricators to meet increasing environmental and safety expectations.
Flex PCB designs continue to move toward thinner constructions, higher circuit density, and more demanding bend requirements. Traditional electroless nickel finishes can expose manufacturers to cracking, copper damage, and open-circuit risks. Fabricators also face growing pressure from customers and regulators to reduce the use of hazardous chemistries and improve EH&S performance.
Affinity Flex was developed specifically to address these challenges. Its advanced electroless nickel technology delivers enhanced flex reliability through a unique columnar grain structure. This provides the performance required for modern flex applications while meeting the Institute for Printed Circuits (IPC) requirements for ENIG finishes. At the same time, compatibility with cyanide-free technology, lower energy consumption and minimized waste generation enable safer, more sustainable production without sacrificing throughput or cost efficiency.
Mr. Lin Denghuan from Shenzhen Moker commented: “For Moker, the introduction of the cyanide‑free flexible ENIG process line supports the rapidly growing customer demand in the high‑reliability flexible PCB and rigid‑flex PCB sectors. The process’s overall performance in solderability, wire‑bonding reliability, and process stability makes it highly suitable for end markets requiring extremely high levels of quality and consistency, including automotive electronics, AI smart devices, telecommunications, and other mission‑critical electronic applications.”
Mr. Lin continued, “Our experience working with MacDermid Alpha to establish the Affinity Flex process has been very positive. Their expertise and technical know‑how accelerated the setup and helped us overcome technical challenges smoothly. We not only gained a reliable surface finishing process but also strengthened the trust of our customers and end‑device manufacturers (OEMs).”
“Cyanide-based gold processes have been a long-standing concern for flex manufacturers balancing performance with EH&S compliance,” said YK Choong, Asia Product Manager for Final Finishes at MacDermid Alpha. “This installation proves that high-reliability ENIG can be achieved without compromising safety, sustainability, or cost of ownership.”
“As we continue to expand our technology leadership in the flex and rigid-flex market, partnerships with valued customers like Shenzhen Moker are essential,” said Dr. Frank Xu, Director, Final Finish Line of Business, at MacDermid Alpha. “Their adoption of Affinity Flex reflects the growing demand for advanced, reliable, and environmentally conscious final finish solutions.”
The installation of Affinity Flex at Shenzhen Moker was successfully completed in October 2025. It incorporates a cyanide-free immersion gold formulation engineered to create a safer working environment for operators while significantly reducing chemical usage and power consumption. The project reflects a shared commitment to advance safer, more sustainable manufacturing practices without compromising performance.
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Applications, Challenges, and the Future of Flex–Packaging Integration, Part 2
04/16/2026 | Anaya Vardya, American Standard CircuitsIn the second of this two-part series, Anaya Vardya of American Standard Circuits examines applications, challenges, manufacturing considerations, and future trends emerging from the convergence of flexible printed circuit boards and advanced semiconductor packaging. Applications driving the convergence include consumer electronics, automotive systems, medical, wearables, aerospace and more.
Flexible Thinking: Designing Flex Circuits for Dynamic Reliability
04/09/2026 | Joe Fjelstad -- Column: Flexible ThinkingFlex circuits flex. No surprises there. However, they are also very commonly designed into products because they are thin and offer consistent thickness and dielectric properties, attributes highly prized by present-day product designers of personal electronics. This would include smartphones and, increasingly, wearable electronics for medical monitoring and even fashion.
Flex Announces Agreement to Acquire Electrical Power Products (EP²)
04/06/2026 | FlexFlex announced that it has entered into a definitive agreement to acquire Electrical Power Products, Inc. (EP2), a leading provider of engineered-to-order electrical power control and protection systems.
Global Flexible PCB Market to Nearly Double, Reaching $41.7 Billion by 2030
04/03/2026 | Globe NewswireThe global flexible printed circuit board (FPCB) market is projected to grow from $21.5 billion in 2024 to $41.7 billion by 2030, reflecting a compound annual growth rate (CAGR) of 12.3%, according to a new report from BCC Research.
Eltek Reports $5.3 Million Order and Provides Update on Q1 2026 Outlook
04/02/2026 | PRNewswireEltek Ltd., a leading global manufacturer of high-quality printed circuit boards, announced that it has received purchase orders totaling approximately $5.3 million from an international customer.