Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

Rewriting Metallization, One Ink at a Time

06/09/2026 | Marcy LaRont, I-Connect007 Magazine
Additive manufacturing has long promised to reshape how electronics are built, but that promise has remained just out of reach for many in the PCB industry who are limited by materials, performance trade-offs, and real-world manufacturability. Electroninks aims to change that equation by rethinking metallization at the chemical level by developing metal-complex inks that challenge established approaches and open new possibilities for advanced packaging, interconnects, and beyond.

Remtec to Attend IEEE International MTT- Symposium 2026 in Boston

06/05/2026 | Remtec
Remtec, a leading innovator in advanced ceramic substrates and microelectronic assembly solutions, announced that it will be attending the upcoming IEEE International MTT- Symposium 2026, taking place June 7–12, 2026, at the Thomas M. Menino Convention & Exhibition Center (MCEC) in Boston, Massachusetts.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/22/2026 | Nolan Johnson, I-Connect007
It’s been a busy week in the news. I could legitimately have published another five items because there were so many meaningful topics. So, I start with attorney James Kim, who returns to update us on metals tariffs. Brian Chislea and Cody Schoener from Dow recently published a book on UV curable conformal coatings. The Taiwan Printed Circuit Association has launched a PCB-specific AI knowledge base. SEMI FlexTech is seeking proposals for advancing flexible hybrid technologies, and the Global Electronics Association has launched the Global Electronics Policy Council, unifying its advocacy voices.

An Active, Growing PCB Industry Tilts Toward High-Complexity Leaders

05/21/2026 | Mike Carano and Thiago Guimaraes, Global Electronics Association
Recent PCB market conditions point to an industry that is active and still expanding in important segments. Demand tied to AI infrastructure, servers, high-layer-count multilayer boards, HDI, ADAS, and defense-related programs remains an important driver of the market. These segments are helping sustain momentum even as conditions in other areas remain more mixed. The result is not a uniformly rising market, but one in which enough high-value activity is flowing through to keep much of the industry on a solid footing.

SMTA Symposium on Counterfeit Parts & Materials Program Finalized

05/20/2026 | SMTA
The SMTA is pleased to announce the technical program for the Symposium on Counterfeit Parts & Materials. Co-organized by SMTA and the Center for Advanced Life Cycle Engineering (CALCE), the event will be held June 23-25, 2026 in Hyattsville, Maryland at the College Park Marriott Conference Center.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in