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Knocking Down the Bone Pile: Interposer Rework and Precision Solder Ball Attachment

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An interposer is a thin substrate positioned between a semiconductor device, such as a BGA and PCBA, containing conductive features that allow electrical connections to be rerouted, recreated, or modified between the component and the PCB. Interposers may be manufactured from organic materials such as polyimide or FR-4, as well as silicon, glass, or other specialized materials. In PCB rework, they are most commonly used when the existing board design cannot easily be modified through conventional rework techniques.

SMTA Renames Event as Microelectronics Packaging & Integration Symposium

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Kimball Electronics Thailand Joins 2026 Ubuntu Fun Run for Conservation

10/20/2026 | Kimball Electronics
On October 18, 2026, 140 employees from Kimball Electronics Thailand joined the Ubuntu Fun Run 2026 charity walk-run event at Khao Kheow Open Zoo.

KAGA Electronics Signs Contract Manufacturing Agreement with Star seeds for AI Servers

10/13/2026 | KAGA ELECTRONICS
KAGA ELECTRONICS CO., LTD. hereby announces that it has entered into a basic agreement with Star seeds Co., Ltd., an AI infrastructure provider offering end-to-end solutions entirely within Japan, from GPU procurement to AI data center construction and operation.

UVJC to Launch NovaJet at WESEMiBAY as Semiconductor Scaling Evolves

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Universal Vapor Jet Corporation (UVJC) is set to unveil NovaJet, the first commercial system built on its proprietary Universal Vapor Jet Printing (UVJP) platform, at the WESEMiBAY Semiconductor Ecosystem Conference and Expo in Shenzhen, China, from 14 to 16 October 2026.
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