ASTER and Siemens: Design for Test Gets ‘Real’

Estimated reading time: 1 minute

For more than 30 years, ASTER Technologies has been a leader in PCB assembly test verification and engineering software. Siemens Digital Industries Software and ASTER Technologies’ recent merger represents the third strategic acquisition by Siemens in the space between design and manufacture.

We spoke with ASTER Technical Director Will Webb, Michael Alam, head of corporate development for Siemens’ Electronic Board Systems Group, and Patrick Hope, Valor marketing specialist at Siemens, about the strategy and vision that’s bringing all these post-layout tools into the design workflow.

Nolan Johnson: Michael, why did ASTER catch Siemens’ eye as a potential acquisition?

Michael Alam: Siemens has a pretty comprehensive tool chain, from component creation and schematic design, to layout, simulation and analysis, and manufacturing handoff. But there are still gaps in that portfolio. A few years ago, we noticed a gap around component information and the need to left-shift that mindset very early in the design process.

We purchased Supplyframe, which helped to fill those gaps. Last year, we had two acquisitions in the manufacturing space: Downstream, which is very complementary to our technology, and ASTER. The intent is to look at where customers are starting to use other tools, bring them into the Siemens family, and eventually have those tools finely tuned and integrated into the design flow. ASTER specifically complements our Valor NPI technology and creates that designed-for-testability aspect.

Johnson: Is “filling the gap” enough for what Siemens’ hopes to accomplish?

Alam: There has to be more value, so we are planning to left-shift ASTER’s capabilities early in the workflow. We did the same with Supplyframe: left-shifting to the component selection as early as possible. We highlighted component storage and pricing issues and allowed the engineers to potentially switch out components at the schematic stage before they caused issues later on.

To continue reading this interview, which originally appeared in the March 2026 edition of I-Connect007 Magazine, click here.