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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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PCB Process Innovations Explained with Rich DePoto
April 3, 2026 | Real Time with... APEX EXPOEstimated reading time: Less than a minute
Richard DePoto details Uyemura's expanded PCB process solutions and their enhanced product portfolio, advanced IC substrate technology, and innovative approaches to high-frequency circuit manufacturing. Uyemura is committed to R&D and customized solutions for the electronics industry.
APEX EXPO 2026 has concluded successfully. If you couldn’t make it to the show, don’t worry, the I-Connect007 team has coverage of the entire week’s events. Watch your inbox on Fridays over the next several weeks for our complete coverage, delivered directly to your inbox, or visit Real Time with… APEX EXPO 2026 now for video interviews with the movers and shakers of the electronics industry.
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Simon Khesin - Schmoll MaschinenSuggested Items
April Issue of I-Connect007 Magazine: Beyond the Rulebook
04/14/2026 | I-Connect007 Editorial TeamIn this month’s I-Connect007 Magazine, we asked PCB designers, fabricators, and suppliers what it really means to operate without a rulebook. Their perspectives vary, especially between seasoned designers and experienced fabricators, but a common thread emerges: progress depends on pushing boundaries and finding a way forward, even when the path isn’t clear. In many ways, this mindset has always been part of what we do, whether we’ve called it that or not.
Powering the Future: Why Thermal Management Defines the Future of Electronics
04/15/2026 | Brian Buyea -- Column: Powering the FutureEvery leap forward in electronics comes with a familiar consequence: heat. Whether it’s a power module driving an electric vehicle, a laser diode used in surgery, or a 5G amplifier operating in orbit, higher performance inevitably means higher temperatures. While engineers celebrate breakthroughs in speed, density, and power, none of those specifications matter if the system can’t keep cool long enough to perform reliably.
Regional Electronics Growth and Initiatives with Gaurab Majumdar
04/14/2026 | Real Time with... APEX EXPONolan Johnson interviews Gaurab Majumdar, vice president of Global Electronics Association India and South East Asia, about positive developments in the regions he oversees. Key initiatives include an MoU with India's Ministry of Defense for a PCB test lab in Bangalore and workforce development programs in Southeast Asia. These efforts aim to bolster local industries, reduce costs, and foster self-sufficiency in semiconductors and PCBs.
Technica USA and DCT Partnership Insights
04/10/2026 | Real Time with... APEX EXPOThis discussion features Jason Perry from Technica and David Bures from DCT Cleaning, highlighting Technica's expansion in PCB fabrication and assembly. DCT, a leader in cleaning solutions, emphasizes the renewed importance of cleaning in modern electronics due to miniaturization. Comprehensive offerings and an innovative approach to achieving optimal cleanliness is revealed.
East Asia's Electronics Dominance and AI with Sydney Xiao
04/08/2026 | Real Time with... APEX EXPOSydney Xiao, Global Electronics Association – East Asia President emphasizes the region's dominance in electronics manufacturing, particularly with the rise of AI. The association focuses on standards, workforce, technology, and collaboration to help members navigate AI opportunities, highlighting new IC substrate standards and advanced packaging initiatives.