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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Magnalytix Taps Metal Etch Services as Trusted Stencil Supplier for OE in a Box Kits
April 7, 2026 | MagnalytixEstimated reading time: 1 minute
Magnalytix, providing real-time reliability solutions for electronics manufacturing, has chosen Metal Etch Services, Inc. as its stencil partner for OE in a Box kits. The two companies have worked together for years, and Metal Etch’s quality and reliability made them the clear choice for this project.
“Great products start with great partners,” said Bobby Glidwell, Director of Technology, Magnalytix. “We’ve trusted Metal Etch Services for years for their stencils, so using them for OE in a Box kits was an easy decision. They consistently deliver high-quality, precise products and have been a dependable partner every step of the way.”
OE in a Box is designed to make Objective Evidence testing simple. Each kit includes 10 B-52 Legacy 2 Test Cards, B-52 Legacy 2 Components on tape and reel, stencils from Metal Etch Services, ESD bags, and other essentials to generate an IPC J-STD-001 Objective Evidence report. Kits are shipped directly to manufacturers with a return label so boards can be sent back to Magnalytix for testing and fast delivery of validation reports.
Metal Etch Services produces high-quality stencils using carefully sourced materials, optimized aperture designs, and advanced laser-cutting technology. Their stencils provide the accuracy and consistency that OE in a Box kits require, while still meeting tight deadlines.
“Working with Metal Etch Services gives us confidence that every kit includes stencils that perform exactly as expected,” said Magnalytix President Mike Bixenman, DBA. “Their expertise makes it easier for our customers to run tests, get results, and keep their processes moving smoothly.”
By combining Magnalytix’s OE in a Box kits with Metal Etch Services’ stencils, the partnership provides manufacturers with a complete, reliable solution for electronics reliability testing.
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Simon Khesin - Schmoll MaschinenSuggested Items
Henger Targets AI PCB Challenges With Advanced Plasma Technology
04/02/2026 | I-Connect007 Editorial TeamHenger is pushing the boundaries of PCB manufacturing with its dynamic, next-generation plasma technology, purpose-built for the demands of AI-driven electronics. As designs move toward higher density, faster speeds, and advanced materials like M9 laminates, Henger’s innovative plasma systems deliver precise, uniform, and energy-efficient processing. In this interview, company leaders, Zhiquang Li and Ping Tang discuss how their cutting-edge solutions are redefining cleaning, surface activation, and process control—positioning plasma technology as a critical enabler of reliability and performance in the rapidly evolving AI hardware landscape.
Understanding Tolerances in Flexible Circuit Design
04/01/2026 | Chris Clark, Flexible Circuit TechnologiesThe challenge with cumulative tolerances is meeting the dimensional requirements for items dimensioned on a drawing or specification for a flexible or rigid-flex circuit. It is critical to understand the fabrication processes and how features are defined when creating your tolerance requirements.
New, Greener Solutions for Etch: Novel Copper Extraction
03/30/2026 | Richard Nichols, GreenSource Engineering“Novel” is a typical marketing phrase that implies new and unique, but often “novel” actually means an established technology being applied to a new field or application. This, in turn, is often driven by newly relevant external motivation. GreenSource has been working on just such a solution: novel copper extraction, offering a better and greener alternative to traditional LLE control systems for cupric chloride etch.
The Chemical Connection: Managing Cumulative Process Variations for Fun and Profit
03/23/2026 | Don Ball -- Column: The Chemical ConnectionTolerances have become increasingly tight as PCBs have grown more complex and reduced in size, weight, and power consumption. Even if we maintain a traditional ±10% variation in etched line width, the tolerance in a 50 µm (0.002" or 2 mils) wide etched line is only 5 µm (0.0002” or 0.2 mils). That’s not very much, and it gets even worse as the line and space requirements drop to 25 µm lines and spaces.
Connect the Dots: Designing for the Future of Manufacturing Reality—Strip-Etch-Strip
02/19/2026 | Matt Stevenson -- Column: Connect the DotsThe demand for ultra-high density interconnect (UHDI) PCBs is growing as electronic devices become increasingly advanced. That means we will be creating more designs that need to align with the reality of manufacturing UHDI boards. My last column on this subject focused on plating, and we are ready to discuss the strip-etch-strip (SES) process. With UHDI boards, footprints are smaller and tolerances are tighter. Your big design challenge associated with the SES process involves trace width and spacing control. The etching process can undercut traces and alter their final size.