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Suggested Items

Henger Targets AI PCB Challenges With Advanced Plasma Technology

04/02/2026 | I-Connect007 Editorial Team
Henger is pushing the boundaries of PCB manufacturing with its dynamic, next-generation plasma technology, purpose-built for the demands of AI-driven electronics. As designs move toward higher density, faster speeds, and advanced materials like M9 laminates, Henger’s innovative plasma systems deliver precise, uniform, and energy-efficient processing. In this interview, company leaders, Zhiquang Li and Ping Tang discuss how their cutting-edge solutions are redefining cleaning, surface activation, and process control—positioning plasma technology as a critical enabler of reliability and performance in the rapidly evolving AI hardware landscape.

Understanding Tolerances in Flexible Circuit Design

04/01/2026 | Chris Clark, Flexible Circuit Technologies
The challenge with cumulative tolerances is meeting the dimensional requirements for items dimensioned on a drawing or specification for a flexible or rigid-flex circuit. It is critical to understand the fabrication processes and how features are defined when creating your tolerance requirements.

New, Greener Solutions for Etch: Novel Copper Extraction

03/30/2026 | Richard Nichols, GreenSource Engineering
“Novel” is a typical marketing phrase that implies new and unique, but often “novel” actually means an established technology being applied to a new field or application. This, in turn, is often driven by newly relevant external motivation. GreenSource has been working on just such a solution: novel copper extraction, offering a better and greener alternative to traditional LLE control systems for cupric chloride etch.

The Chemical Connection: Managing Cumulative Process Variations for Fun and Profit

03/23/2026 | Don Ball -- Column: The Chemical Connection
Tolerances have become increasingly tight as PCBs have grown more complex and reduced in size, weight, and power consumption. Even if we maintain a traditional ±10% variation in etched line width, the tolerance in a 50 µm (0.002" or 2 mils) wide etched line is only 5 µm (0.0002” or 0.2 mils). That’s not very much, and it gets even worse as the line and space requirements drop to 25 µm lines and spaces.

Connect the Dots: Designing for the Future of Manufacturing Reality—Strip-Etch-Strip

02/19/2026 | Matt Stevenson -- Column: Connect the Dots
The demand for ultra-high density interconnect (UHDI) PCBs is growing as electronic devices become increasingly advanced. That means we will be creating more designs that need to align with the reality of manufacturing UHDI boards. My last column on this subject focused on plating, and we are ready to discuss the strip-etch-strip (SES) process. With UHDI boards, footprints are smaller and tolerances are tighter. Your big design challenge associated with the SES process involves trace width and spacing control. The etching process can undercut traces and alter their final size.
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