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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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onsemi Powers Sineng Electric’s Advanced Solar and Energy Storage Solutions
April 8, 2026 | onsemiEstimated reading time: 2 minutes
onsemi announced that its hybrid power integrated modules (PIMs) will be featured in Sineng Electric’s next-generation 430 kW liquid-cooled string energy storage systems (ESS) and 320 kW utility-scale solar inverter. The design win builds upon the longstanding collaboration between onsemi and Sineng to deliver high-performance, future-ready solutions in the growing renewable energy and AI infrastructure markets.
Industry-Leading Power Module Technology
At the core of Sineng’s new platforms, onsemi’s latest-generation Field Stop (FS7) insulated-gate bipolar transistor (IGBT) and silicon carbide (SiC) hybrid PIMs in the F5BP package are engineered to boost the power output of utility-scale solar string inverters and energy storage systems (ESS). Compared to previous generations, the modules offer 32% increased power density with 0.1% higher efficiency within the same footprint to increase the total system power of a solar inverter from 320 kW to 350 kW.
Setting New Standards for Efficiency and Reliability
onsemi’s hybrid F5BP PIMs integrate the company’s FS7 IGBT and EliteSiC diode technologies, reducing power dissipation by up to 8% and switching losses by 10% compared to previous generations. Their advanced direct bonded copper (DBC) substrate design minimizes stray inductance and lowers thermal resistance to the heat sink by 9.3%. Together, the reduction in switching losses and thermal resistance enables up to 32% higher system power at the same weight and density compared to prior‑generation designs. The modules also feature an optimized electrical layout and an innovative baseplate design that enhance thermal management. This combination enables superior system performance and enhanced long-term reliability.
Compared to previous-generation modules, onsemi’s latest FS7‑based hybrid PIM combines lower switching losses and reduced thermal resistance, enabling the following system‑level improvements in Sineng’s new 430 kW string ESS:
- A 0.75% increase in round-trip efficiency (RTE), building on module‑level efficiency gains demonstrated in benchmark testing
- 5% reduction in auxiliary power consumption, lowering total operating costs
- Higher power density, reducing the number of required modules and cutting component costs
- Cooler operation under high loads and improved reliability
- Enabling a More Stable and Reliable Renewable Grid
“Utility‑scale operators are laser‑focused on squeezing more kilowatts from the same footprint while cutting lifecycle costs. By integrating onsemi’s F5BP package hybrid modules into our 430 kW ESS and 320 kW inverter platforms, we’re addressing two industry imperatives at once: higher power density that uplifts system ratings, and conversion efficiency gains that compound at gigawatt scale. Those incremental improvements translate into real savings for product development and a more stable, dispatchable renewable grid.” – Jianfeng Sun, General Manager of Research and Development, Sineng Electric
“Developers need solutions that fit existing layouts, simplify thermal design, and reduce energy losses. By pairing FS7 IGBTs with EliteSiC diodes in our F5BP modules, we deliver higher conversion efficiency and power density without increasing the footprint, enabling significantly higher power ratings at the same system size. This combination allows utility‑scale solar and storage sites to increase output from existing installations, while improving reliability and lowering lifetime operating costs.” – Sravan Vanaparthy, VP & GM of IGBT Power Division, onsemi
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Alpha and Omega Semiconductor Begins IPM5 Production at Kaynes Semicon Launch in Gujarat
04/16/2026 | Alpha and Omega Semiconductor LimitedAlpha and Omega Semiconductor Limited, a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, marks a historic expansion of its global manufacturing footprint with the official inauguration of Kaynes Semicon’s state-of-the-art OSAT facility in Sanand, Gujarat.
HYFIX Raises $15M to Build U.S.-Made Chips for Next-Gen Drones and Robots
04/15/2026 | PRNewswireHYFIX Spatial Intelligence, Inc., a U.S.-based semiconductor company, announced a $15 million seed round to build and manufacture a new class of American-made chips designed to power high-precision drones and autonomous robots.
Koh Young Highlighting its Smart AI Solutions at the SMTA Monterrey Expo and Tech Forum
04/15/2026 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection solutions, will exhibit at the upcoming SMTA Monterrey Expo & Tech Forum on Thursday, April 23, 2026, at Cintermex, located at Av. Fundidora 501, Colonia Obrera, Monterrey, Nuevo León, Mexico.
Powering the Future: Why Thermal Management Defines the Future of Electronics
04/15/2026 | Brian Buyea -- Column: Powering the FutureEvery leap forward in electronics comes with a familiar consequence: heat. Whether it’s a power module driving an electric vehicle, a laser diode used in surgery, or a 5G amplifier operating in orbit, higher performance inevitably means higher temperatures. While engineers celebrate breakthroughs in speed, density, and power, none of those specifications matter if the system can’t keep cool long enough to perform reliably.
Coherent Advances 10kV SiC Epitaxy for AI Datacenters
04/13/2026 | CoherentCoherent Corp., a global leader in photonics, announced advancements in its silicon carbide (SiC) epitaxy capabilities, enabling power devices up to 10kV for next-generation AI datacenter and industrial power applications.