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Below the Surface: Why Thermal Failure Is Still the No. 1 Killer in Power Electronics

08/13/2026 | Chandra Gupta -- Column: Below the Surface
Why do power electronics fail? There’s a range of answers, from overvoltage and mechanical stress to poor assembly and environmental exposure. If you ask your favorite AI search engine for an answer, you’ll get a pretty simple response: excessive temperature leads to component degradation, material breakdown, and eventual failure. In a sense, that’s true, but it’s oversimplified and incomplete. The real issue is thermal management failure at the system level. Heat is still the number one killer, and most of the time, you don’t even realize it’s there.

Heron Power Selects First U.S. Factory for Next-Generation Power Electronics

08/13/2026 | PRNewswire
Heron Power, an American advanced power electronics manufacturer, announced it has selected Morgan Hill, California as the home of its first large-scale factory.

A Practical Approach to Material Selection for High Power PCBs

08/13/2026 | Drew Delaney, Isola Group
With AI server architectures demanding high-power converter solutions to improve power efficiency and affordability, PCB design can challenge engineers who treat material selection as a single-variable problem. Pick a laminate for thermal conductivity, and you may experience a CTE mismatch that cracks vias after 50 thermal cycles. Optimize for dielectric loss, and you might sacrifice the isolation margin your certification depends on. High-power boards require consideration of multiple variables, including electrical, thermal, mechanical, reliability, and manufacturability, which cannot be optimized alone.

Soctera Raises $4M to Advance Thermal Solutions for Defense and Space

08/12/2026 | PRNewswire
Soctera, Incorporated has closed $4 million in seed funding backed by Anorak Ventures and Multiball Capital, with additional participation from 9Yards Capital, Mana Ventures, and Red Bear Ventures.

Molex Launches MiniMix Connectors for Humanoid Robotics

08/06/2026 | PRNewswire
Molex, a global electronics leader and connectivity innovator, unveiled MiniMix Hybrid Power and Signal Connectors, a purpose-built interconnect platform designed to solve manufacturing and packaging challenges in next-generation humanoid robotics, autonomous mobile robots (AMRs) and advanced industrial automation systems.
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