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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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The Hidden Enabler of Autonomous Warfare: Advanced PCB Technologies Behind Defense AI

06/16/2026 | Jesse Vaughan -- Column: Beyond the Board
Autonomous systems are rapidly reshaping the defense landscape. Unmanned aerial systems, autonomous maritime vessels, robotic ground vehicles, loitering munitions, and AI-enabled sensing platforms are now integral components of modern military operations. AI may serve as the brain of an autonomous system, but advanced PCBs form the foundation that allows those capabilities to operate reliably in the field.

Advanced Packaging: A Central Axis of Innovation in A&D, Automotive

06/11/2026 | I-Connect007 Editorial Team
Presenters in the Aerospace & Defense Special Session at APEX EXPO 2026 made one message abundantly clear: Advanced packaging has moved from a supporting role to a primary system enabler, particularly in high-reliability markets where performance, longevity, and environmental resilience are non-negotiable. The March Technical Conference at APEX EXPO focused on advanced electronics for the first time this year, with two Special Sessions featuring a carefully curated selection of presentations examining how design priorities, material choices, and manufacturing strategies are evolving in response to these demands.

Below the Surface: From Nanometers to 10-Gauge—It’s More Than Just a Wire

06/11/2026 | Chandra Gupta -- Column: Below the Surface
Modern life runs on wires: your cell phone, your car, the satellites orbiting above us, and even the dryer in your laundry room all depend on the simple idea of moving electricity from one place to another. From nanometer-scale traces etched onto a semiconductor chip to a thick 10-gauge copper wire carrying current to heat your clothes, it’s tempting to say, “It’s just a wire.” But that hides the real story. The magic isn’t the wire itself, but in the materials that insulate, protect, support, and connect it, often under extreme conditions of heat, voltage, vibration, and time.

Powering the Future: When Material Choice Defines RF Performance

06/10/2026 | Brian Buyea -- Column: Powering the Future
In RF and microwave design, deciding on which materials to use determines whether your design merely works or truly performs. Yet, designers too often fall back on material selection that is familiar, available, or “good enough.” However, once you move into higher frequencies, higher power densities, and tighter performance tolerances, “good enough” becomes the very thing that holds your design back. That’s where ceramic substrates become a fundamentally different approach to solving RF challenges.

First Mold Expands University Partnerships to Build Next-Generation Manufacturing Talent Pipeline

06/05/2026 | PRNewswire
First Mold announced a long-term partnership with learning institutions, including universities, to enhance the development of skilled talent within their systems.
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