-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Technica Announces Tech Day Event Dates and Agenda
April 13, 2026 | Technica USAEstimated reading time: 1 minute
Technica USA announced today the return of its highly anticipated Tech Day events, marking the revival of a long‑standing customer engagement series. Personal invitations have been issued to customers detailing event dates, participating partners, and the technical agenda.
The 2026 Tech Day series will focus on Big BGA, a critical and timely topic driven by the rapid growth of artificial intelligence and its increasing influence on advanced electronics manufacturing.
The event will be held on May 13 and 14, 2026, providing attendees with flexible options to participate. Each day will feature the same agenda, beginning with a morning technical session followed by an afternoon of live demonstrations aligned with the morning presentations.
Participating companies include ASMPT, ESSEMTEC, PARMI, and Creative Electron, each bringing specialized expertise to address the challenges associated with large BGA placement, inspection, and handling. The foundation of the demonstrations will be the ASMPT SX platform with large BGA placement capability, a solution designed to meet the demands of high‑value AI-driven devices.
“Technica is excited to bring back Tech Day for our customers,” said Jason Perry, President of Technica USA. “These events were a cornerstone of how we connected with our customers in the past. While the disruption of recent years paused that engagement, we are now fully focused on delivering meaningful, technical value through in‑person collaboration. Addressing Big BGA challenges is especially important for our customers as AI continues to reshape electronics manufacturing.”
In addition to ASMPT’s large BGA placement solutions, Essemtec will demonstrate reballing, and other capabilities for sensitive BGAs and electronic components, while PARMI and Creative Electron will highlight the role their inspection and X‑ray technologies play in ensuring manufacturing quality and reliability.
Several additional Technica supply partners, including Inovaxe, DCT, REECO, and Electro Design, will also be present to engage with customers and discuss new and ongoing applications.
Technica’s Tech Day events are designed to provide customers with practical insights, hands on demonstrations, and direct access to industry experts, reinforcing Technica’s commitment to delivering innovative solutions and trusted partnerships across the electronics manufacturing industry.
Please contact Yannick Green, ygreen@technica.com, or Jeff Forster, jforster@technica,com, to learn more and register.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Cicor Secures New Customers in Q1
04/14/2026 | CicorCicor Group recorded a strong order intake in the first quarter of 2026, in particular driven by the Aerospace & Defence (A&D) market.
Standard of Excellence: Engineering Is the New Sales—How Technical Collaboration Wins Business
04/15/2026 | Anaya Vardya -- Column: Standard of ExcellenceWhen it comes to complex, high-performance electronics, the line between sales and engineering has all but disappeared. Customers want more than a quote. They’re not simply buying boards; they’re buying understanding, so engineering is now the front line of customer trust, problem-solving, and long-term success. There was a time when sales meant persuasion, and engineering meant production. Today, the two are inseparable.
Horizon Sales Expands Consumables Portfolio with ROCKA Partnership
04/10/2026 | Horizon SalesHorizon Sales, a leading manufacturers’ representative and distributor to the electronics industry, has been appointed as an official U.S. distributor for ROCKA Solutions, a North American manufacturer known for delivering high-quality, cost-effective consumables to the electronics manufacturing industry.
PHOTO GALLERY: A Show Floor Showcase, Part 2
04/03/2026 | I-Connect007Take a walk back through APEX EXPO with our photo gallery, capturing the faces, moments, and energy from across more than 400 booths on the show floor. This week, we’re highlighting our many customers, and some of the work in the I-Connect007 booth, where we conducted dozens of video and audio interviews. It’s a chance to see who was there, what was happening in real time, and maybe even spot yourself in the crowd.
Gartner: Over 50% of Customer Service Orgs to Double Tech Spend by 2028
04/02/2026 | Gartner, Inc.By 2028, over 50% of customer service organizations will double their technology spend, without an equivalent reduction in talent, according to Gartner, Inc., a business and technology insights company.