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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Foxconn Recognized as Top 100 Global Innovators 2026
April 14, 2026 | FoxconnEstimated reading time: 2 minutes
Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer and leading technology service provider, has been named in Clarivate’s Top 100 Global Innovators 2026, a milestone for the ninth year running and as the accelerating role of artificial intelligence stood out in innovation activity among peers in the prestigious ranking.
Known as the 1% of the 1%, the Top 100 Global Innovators navigate complexity with clarity and set the pace for invention quality, originality and global reach. In 2026, Foxconn was ranked 35th and part of the leading sector of electronics and computing that represented 27% of the list. From Taiwan, Foxconn was top ranked among non-semiconductor Taiwanese peers.
Mick Lin, Director of the IP Affairs Division at Foxconn said, “Our patent filings grew 15% on-year last year, with AI technology behind some of the IP. At the same time, our inventors, engineers and administrators are able to accelerate their patent application efficiency and related analysis work due to AI-enabled processes.”
Maroun S. Mourad, President, Intellectual Property, Clarivate, said: “Recognition as a Top 100 Global Innovator is a remarkable achievement given the pace of change. Multi-year winners and new entrants are investing in AI innovation as it redefines the boundaries between research, engineering and commercial execution. The leaders we celebrate today are not just responding to this shift, they are designing for it.”
The Top 100 Global Innovators account for a disproportionate share of the world’s most valuable ideas, demonstrating that innovation leadership is defined by precision and strategic intent. This year’s ranking not only celebrates enduring innovation leadership, but it also reveals the forces reshaping that leadership, with AI at the forefront. The Top 100 Global Innovators contribute an exceptional 16% of the world’s highest-strength AI inventions.
The Top 100 Global Innovators analysis is underpinned by the Clarivate Center for IP and Innovation Research. Their analyses are founded in rigorous research leveraging the proprietary Derwent Strength Index, derived from the Derwent World Patents Index (DWPI) and its global invention data to measure the influence of ideas, their success and rarity, and the investment in inventions.
Clarivate is a leading global provider of transformative intelligence, identifies and ranks theorganizations that consistently deliver high-impact inventions, shaping the future of innovation across industries.
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Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
Bosch Executive Erik Rein Elected New President of ESIA
04/21/2026 | ESIAOn 20 April 2026, the General Assembly of the European Semiconductor Industry Association (ESIA) gathered to elect Erik Rein, Executive Vice President and Board Member Mobility Electronics responsible for semiconductor business at Bosch, as the organisation’s new President.
Marcy’s Musings: Operating Without a Rulebook
04/15/2026 | Marcy LaRont -- Column: Marcy's MusingsWhat happens when the rulebook is no longer useful, or worse, has not yet been written? With electronics innovation happening at warp speed, we’re increasingly asked to design and build what has no precedent, proven path, or tidy checklist to follow. “Design for invention” begins at the edge of known capability, where traditional DFM gives way to something far less certain, and far more exciting. It’s not about breaking rules for the sake of it; it’s about recognizing when the rules no longer apply and having the insight, collaboration, and courage to move forward anyway.
Keysight, Sateliot Win European Space Agency and GSMA Foundry Challenge for 6G Innovation
04/08/2026 | Keysight Technologies, Inc.Keysight Technologies, Inc., together with Sateliot, has been named a winner of the fifth annual European Space Agency (ESA) and GSMA Foundry Innovation Challenge for its joint project, “Blockchain-enabled anomaly detection end‑to‑end solution for 5G Non‑Terrestrial Networks.”
Wire Harness Taking a Step in the Right Direction
04/08/2026 | Nolan Johnson, SMT007 MagazineTo fully understand the modernization of wire harness design and assembly, we met with members of the Innovation Advisory Team for the Wire Harness Manufacturer’s Association (WHMA) to outline the current challenges facing wire harnesses and the specific steps to implement a digital data flow from OEM to manufacturer and back. In some ways, the wire harness industry is moving from 19th-century to 21st-century technology. But in the meantime, the real challenge isn’t building the harness—manufacturers are very good at that.