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Würth Elektronik Expands Laboratory in Shenzhen, China
April 17, 2026 | Wurth ElektronikEstimated reading time: 1 minute
Würth Elektronik eiSos Group celebrated the official opening of the Laboratory Phase II at its Asia Quality Design Center (QDC Asia) in Shenzhen on March 5, 2026. The inauguration ceremony was marked by a ribbon-cutting event presided over by senior leadership, including the CEO, Thomas Garz, and COO, Dirk Knorr, of the Würth Elektronik eiSos Group, alongside the Head of QDC Asia, Yangyang Chen, symbolically kicking off operations in the new facility.
Established in August 2008, QDC Asia spans approximately 4,700 m², with a dedicated testing area of 1,700 m² housing over 300 pieces of advanced high-precision testing equipment. Operating in strict compliance with ISO/IEC 17025 and ISO/IEC 17043 standards, the center holds accreditations as a testing laboratory, a proficiency testing provider, and a lab recognized by VDE (TDAP), UL (WTDP), and IEC (CTF2). Initially focused on pre-shipment product inspection for production, the Laboratory has evolved into a comprehensive testing center offering a wide range of services including product incoming inspection testing, design change validation, reliability testing, product conformity judgment, material compliance, failure analysis, etc. However, with existing lab space maximized and approaching saturation, expansion became imperative to support the Group’s growing business needs.
“With the expansion of our laboratory facilities in Shenzhen, we are making targeted investments in additional testing capacities, faster validation processes, and even better service for our customers. QDC Asia is an important pillar of our global quality and development strategy and strengthens our ability to meet growing demands for reliability, speed, and technical excellence,” explains Dirk Knorr, COO of the Würth Elektronik eiSos Group.
Future environmental testing capacity to increase by 170%
The newly added 352 m² laboratory is a strategic response to this demand. Primarily designed for environmental and electrical performance testing, the facility is equipped with an energy-efficient VFD chiller featuring advanced magnetic bearing technology, as well as a scalable electrical system capable of meeting peak load demands. A total of 38 testing devices will be gradually deployed across phases to align with actual business needs: 19 units on the ground floor, followed by an additional 19 on a second level. This phased approach maximizes spatial efficiency and delivers optimal cost-effectiveness.
The expansion thus lays the foundation for a significant increase in capacity: In future, throughput for environmental testing is expected to grow by 170 percent compared to current capacity.
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Würth Elektronik Expands Laboratory in Shenzhen, China
04/16/2026 | Wurth ElektronikWürth Elektronik eiSos Group celebrated the official opening of the Laboratory Phase II at its Asia Quality Design Center (QDC Asia) in Shenzhen on March 5, 2026.
Fuse Expands U.S. Radiation Testing Capacity with New Albuquerque Facility
04/13/2026 | PRNewswireFuse, a leading U.S.-based fusion company, announced the establishment of a new state-of-the-art facility in Albuquerque, New Mexico that will expand U.S. radiation effects testing capacity for critical defense, space, and semiconductor technologies.
Magnalytix Taps Metal Etch Services as Trusted Stencil Supplier for OE in a Box Kits
04/07/2026 | MagnalytixMagnalytix, providing real-time reliability solutions for electronics manufacturing, has chosen Metal Etch Services, Inc. as its stencil partner for OE in a Box kits.
Unitemp Launches ESPEC Deep Capacity HAST Chamber in UK for Large PCB Testing
03/24/2026 | UnitempA new deep‑capacity Highly Accelerated Stress Test (HAST) chamber capable of accommodating large multilayer PCBs and high specimen volumes is now available in the UK, as Unitemp introduces ESPEC’s latest model, the EHS‑222M‑L.
Rethinking Test Strategy: New Book Tackles DFT for Today’s Complex Electronics
03/18/2026 | I-Connect007I-Connect007 proudly announces the release of The Printed Circuit Assembler’s Guide to… Design for Test: A Practical Guide to Test and Inspection. As electronics grow more complex, geometries shrink, and packaging densities increase, traditional testing and inspection methods are no longer sufficient. In this timely new release, industry expert Bert Horner of The Test Connection, Inc. provides a practical roadmap for integrating design for test (DFT) into PCB and CCA development, beginning at schematic capture and layout, rather than treating testing as an afterthought.