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Introducing FKN Systek Depanelizer with Linear Guide Table for Small PCBs
April 20, 2026 | FKN SystekEstimated reading time: 1 minute
Singulating small PCBs with circular blade depanelizers can be a tedious repetitive process which can easily result in board damage due to operator fatigue. Increase process quality and safety by using the FKN Systek K2010 motorized circular blade depanelizer with a support table to separate the V-Scored boards.
The operator places the panel onto the front and back guide rails and brings it forward through the front blade guards to be singulated by two 2.5 “ dia. Circular blades. The front blade guards are adjustable so that panel can only be moved forward if the score-line is nested on the lower guide. Two blade guards at the output side of the cutting area prevent operator access to the sharp blades.
The PCB support rail on the left input side of the guide table have an adjustable board stop which can be set to quickly position each panel precisely to enter the cutting plane at the V-Score. Standard support tables have a front and back guide rail which can be universally adjusted to fit a variety of smaller V-Scored PCBs. Customized nesting plates can be designed to your specs for secure board handling during the depaneling process.
Proudly made in the USA, FKN Systek offers customizable tooling and in-line systems. Our durable HSS blades are designed for long life and can be resharpened.
For more information look up our web site at fknsystek.com or email us at FKN@FKNSYSTEK.com.
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Below the Surface: Looking Ahead to Where Integration Actually Happens
04/20/2026 | Chandra Gupta -- Column: Below the SurfaceProgress in RF rarely arrives and suddenly rewrites the rules. What actually moves performance forward almost always happens in the seams, the interfaces, the choices that determine whether individual parts are allowed to work together, or forced to fight one another. So, when we look ahead in RF systems—from DC through millimeter-wave—the most important conversations aren’t about isolated materials or heroic devices. They’re about integration, and more specifically, about how ceramic-based RF packages and module architectures shape system-level behavior long before the signal ever reaches free space.
Scanfil Releases Second Sustainability Report: 2025 Progress and 2026 Ambitions
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Powering the Future: Why Thermal Management Defines the Future of Electronics
04/15/2026 | Brian Buyea -- Column: Powering the FutureEvery leap forward in electronics comes with a familiar consequence: heat. Whether it’s a power module driving an electric vehicle, a laser diode used in surgery, or a 5G amplifier operating in orbit, higher performance inevitably means higher temperatures. While engineers celebrate breakthroughs in speed, density, and power, none of those specifications matter if the system can’t keep cool long enough to perform reliably.