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MIRTEC Opens New Dallas Sales and Demo Center to Strengthen Customer Support

07/30/2026 | MIRTEC
MIRTEC, the global provider of advanced inspection solutions for the electronics manufacturing industry, opens a new ‘Sales and Demo Center, Dallas’ to bring advanced inspection technology closer to North American manufacturers through hands-on demonstrations, application reviews, and direct technical collaboration.

SMTLINK in the Evolution of Mexico's Electronics Industry

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For years, Mexico’s competitive advantage was largely associated with manufacturing capacity, geographic proximity to the United States, and cost efficiency. While those factors remain important, success increasingly depends on a broader set of capabilities: engineering expertise, workforce development, process reliability, automation, and supply chain resilience.

Will Your Vias Survive the Heat? New Book From I-Connect007 Has the Answers

07/30/2026 | I-Connect007
I-Connect007 is excited to announce the release of The Printed Circuit Assembler's Guide to... Via Structures: Reflow Process Survivability, Reliability, and Robustness, the newest title in its technical resources library. Written by reliability expert Bob Neves, the book examines one of the industry's most misunderstood topics: how to properly evaluate PCB via structures for assembly process survivability, long-term reliability, and robustness.

Technica USA and DCT Tackle One of the Biggest Challenges in PCB Cleaning

07/29/2026 | Technica USA
As the industry prepares to explore the critical role of cleaning in today’s increasingly complex PCB manufacturing processes, Technica is gearing up for its upcoming Lunch & Learn event, taking place August 12–13, 2026.

Continued Customer Activity Prompts Technica USA to Announce Remaining 2026 Demo & Applications Center Schedule

07/23/2026 | Technica USA
Technica USA's Demo & Applications Center continues to serve as a valuable resource for customers and supply partners, welcoming a steady stream of planned events, private demonstrations, training sessions, and applications projects throughout the year.
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