GreenSource Fabrication to Exhibit at PCB East 2026
April 23, 2026 | GreenSource FabricationEstimated reading time: 1 minute
GreenSource Fabrication, the N. American industry’s most advanced, state-of-the-art printed circuit board manufacturer, today announced that it will be exhibiting at PCB East 2026, on Wednesday April 29,2026 at the DCU Convention Center 50 Foster Street in Worcester, MA.
Attendees can visit GreenSource Fabrication at Booth 611 to experience firsthand how next-generation manufacturing is redefining speed, sustainability, and performance in PCB fabrication.
At this year’s event, GreenSource Fabrication will showcase its heavily automated, Zero Liquid Discharge (ZLD) equipped, manufacturing facility—designed to deliver high-quality, production-ready PCBs with unmatched efficiency and environmental responsibility. Engineers, designers, and procurement leaders will gain insight into how GreenSource is eliminating traditional trade-offs between speed, cost, and sustainability.
“PCB East is where technical collaborations happen,” said Megan Teta, Strategic Account Manager at GreenSource PCB . “If you are designing next-generation electronics and want a manufacturing partner that matches your ambition, you need to stop by Booth 611. We’re not just building boards—we’re changing how they’re built.”
Visitors to the booth will learn how GreenSource Fabrication supports rapid prototyping, seamless transition to production, and advanced material capabilities—all while maintaining a ZLD wastewater treatment system. The company’s integrated, technology-first approach enables customers to move faster, reduce risk, and bring better products to market.
PCB East 2026 is one of the premier East Coast events for the electronics industry, bringing together innovators, engineers, and decision-makers focused on PCB design, fabrication, and assembly.
If you are attending PCB East 2026, make Booth 611 your first stop. Meet the team. Ask the hard questions. See what the future of PCB manufacturing looks like.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.Subscribe now to stay informed, competitive, and connected.
Suggested Items
Remtec to Showcase Advanced Ceramic Technologies and Present Thermal Management for High-Power Applications at CMSE 2026
04/23/2026 | RemtecRemtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026).
PCB Technologies to Exhibit at PCB East 2026
04/23/2026 | PCB Technologies Ltd.Issey Ende, PCB-Technolgies’ VP of Sales and Marketinghas announced that his company will be exhibiting at this year’s PCB East 2026, the premier East Coast conference and exhibition for the electronics design, fabrication, and assembly industry on Wednesday, April 29, 2026, at the DCU Convention Center in Worcester, Massachusetts.
Fineline Global to Exhibit at PCB East 2026, Showcasing Global PCB Solutions for North American Market
04/23/2026 | Fineline GlobalFineline Global, a leading global provider of advanced printed circuit board (PCB) solutions, today announced that it will be exhibiting at PCB East 2026 on Wednesday, April 29 at the DCU Convention Center in Worcester, Massachusetts.
Koh Young Technology Brings Proven 3D Metrology Expertise to the Advanced Packaging Stage at ECTC 2026
04/21/2026 | Koh Young AmericaKoh Young, the industry leader in True3D™ measurement-based inspection solutions, is bringing its battle-tested platform to where that challenge is being solved at the 2026 IEEE Electronic Components and Technology Conference (ECTC), May 26–29, at the JW Marriott & The Ritz-Carlton Grande Lakes in Orlando, Florida. The advanced packaging industry is demanding a level of inspection precision that traditional metrology simply cannot deliver, and Koh Young is ready to meet that moment.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.