Remtec to Showcase Advanced Ceramic Technologies and Present Thermal Management for High-Power Applications at CMSE 2026
April 23, 2026 | RemtecEstimated reading time: 2 minutes
Remtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026), taking place April 28–30, 2026, at the Renaissance Los Angeles Airport Hotel.
Recognized as the premier event focused on the design, reliability, and application of electronic components for aerospace, defense, and space systems, CMSE 2026 brings together leading engineers, technologists, and innovators to address the industry’s most pressing technical challenges.
As part of the conference’s Day 1 technical program, Chandra Gupta, Director of Business Development at Remtec, will present “Innovative Ceramic Sub-Mounts and Heat Spreaders.” His session will explore advanced thermal management strategies critical to improving the reliability and performance of high-power electronic systems.
High-power semiconductor devices—such as amplifiers and DC-DC converters—face significant thermal challenges that can impact performance and long-term reliability. Dr. Gupta’s presentation will address how advanced ceramic materials and engineered sub-mount designs can dramatically improve heat dissipation, reduce thermal resistance, and extend mean time before failure (MTBF) in mission-critical applications.
“CMSE is one of the most important technical gatherings in our industry because it brings together the people who are solving the toughest reliability challenges in aerospace, defense, and space electronics,” said Mr. Buyea. “For Remtec, it’s an opportunity not just to showcase our technology, but to contribute to the collective advancement of high-performance, high-reliability electronic systems. The conversations that happen here—especially around thermal management and materials innovation—are critical to the future of our industry and the systems that depend on it.”
CMSE 2026 is designed to foster deep technical engagement through high-quality presentations, keynotes, and interactive discussions. The event also plays a vital role in educating the next generation of engineers, ensuring the continued advancement of technologies that support national defense and space exploration.
Remtec’s participation underscores its commitment to solving complex thermal and reliability challenges through advanced materials and integrated manufacturing solutions.
Visit Remtec on the show floor in Booth #B4.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Punching Out: How Are the Big Boys in Electronics Doing?
05/12/2026 | Tom Kastner -- Column: Punching Out!Let’s see what the public companies are up to in the PCB and EMS industries. In North America, there are only a couple of publicly traded PCB companies: TTM Technologies and Firan Technology Group. On the EMS side, there are a few more: Flex, Jabil, Celestica, Sanmina,, Benchmark, Fabrinet, Kimball Electronics, Plexus Corp, Nortech Systems, and Key Tronic Corp. From an M&A standpoint, these public companies have been fairly quiet in the past five years. FTG completed two deals in 2022 (IMI and Holaday), Flex had three deals, Jabil had five deals, and Sanmina had one deal.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
ViaSat-3 F3 Satellite Successfully Launches from Kennedy Space Center
05/04/2026 | BoeingBoeing mission controllers confirmed that the ViaSat-3 F3 (VS-3 F3) satellite is healthy in orbit following its successful launch aboard a SpaceX Falcon Heavy rocket at 10:13 a.m. ET from Kennedy Space Center (KSC) in Florida.
Microchip Expands Post-Quantum Root of Trust Controllers
04/29/2026 | MicrochipAs the industry embarks on the transition to post‑quantum cryptography (PQC), Microchip Technology is expanding its portfolio of Trust Shield, PQC‑ready devices with the TS1800 Platform Root of Trust controller and the TS50x secure boot controller.