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Advanced Electronics Packaging Digest

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Suggested Items

Absolute EMS Adds High-Precision Press-Fit System to Boost Assembly Capabilities

05/21/2026 | Absolute EMS, Inc.
Absolute EMS, Inc., a Silicon Valley–based provider of high-technology electronics manufacturing services, has expanded its advanced assembly capabilities with the addition of the SASinno Americas PF-6T high-precision connector press-fitting system.

Semi-Kinetics Brings on Colin Forgy to Lead Manufacturing at Idaho Facility

05/21/2026 | Semi-Kinetics
Semi-Kinetics, a leading provider of electronic manufacturing services, has named Colin Forgy as Manufacturing Manager at its Nampa, Idaho operation, adding a hands-on leader with a track record of improving performance on the production floor.

Nordson Reports Record Q2 Fiscal 2026 Results and Increases Full Year Guidance

05/21/2026 | BUSINESS WIRE
Nordson Corporation reported results for the fiscal second quarter ended April 30, 2026. Sales were a second quarter record of $741 million compared to the prior year’s second quarter sales of $683 million.

Innovative Flash Copper Plating Technology

05/21/2026 | Andreas Schatz and Mustafa Özkök, MKS’ Atotech
The continuous push toward higher functionality, miniaturization, and performance in modern electronic devices—such as smartphones, wearables, and advanced computing platforms—has intensified the demand for high-density interconnect (HDI) printed circuit boards. Central to HDI performance is the reliable formation of blind microvias (BMVs), which serve as critical interlayer connections in modified semi-additive processes (mSAP).

Fraunhofer IPMS Develops Wafer-Level High-Density Chiplet Systems

05/20/2026 | Fraunhofer IPMS
Breakthrough in chip manufacturing: As part of the European APECS pilot line, researchers at Fraunhofer Institute for Photonic Microsystems IPMS have developed a method that allows different chip components to be fused almost seamlessly into a single unit.
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