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Advanced Electronics Packaging Digest

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Fresh PCB Concepts: Repair and Risk in Electrical Test Failures in PCB Manufacturing

05/21/2026 | Team NCAB -- Column: Fresh PCB Concepts
Electrical test failures represent one of the most critical decision points in PCB manufacturing because they directly expose defects that affect circuit functionality. Unlike cosmetic anomalies or minor process deviations, these failures indicate that the conductive network defined in the design has not been successfully realized in the finished product. Whether identified through continuity testing, isolation testing, or netlist verification, a failed electrical test confirms that the board cannot perform as intended. At this stage, the question is no longer simply whether a defect exists, but whether it can (or should be) repaired.

Rethinking Reinforcement Materials for Advanced Packaging

05/14/2026 | Ivana Ivanovic, Flexiramics B.V.
Materials that once quietly supported the industry are now becoming limiting factors. The electronics industry is experiencing unprecedented pressure as RF systems push into mmWave frequencies, high-speed digital architectures advance into their next performance generation, and power densities climb across automotive, telecom, aerospace, and computing. Reinforcement materials, long treated as a background detail in laminate design, are suddenly at the centre of performance, reliability, and supply‑chain discussions.

Below the Surface: Active Component and Module Submounts—The Architecture Behind Performance

05/20/2026 | Chandra Gupta -- Column: Below the Surface
If you were to peel back the layers of a modern electronic system, such as a satellite transceiver, a LiDAR module, or a 5G base station, you would not immediately notice a specific component doing some of the most important work. It doesn’t amplify signals, emit light, or process data, yet without it, none of those functions would be stable, reliable, or scalable. That component is the active device submount.

PTC Onshape Introduces Direct Altium Integration to Streamline ECAD-MCAD Collaboration

05/12/2026 | PRNewswire
PTC announced a new integration between its cloud-native Onshape® computer‑aided design (CAD) and product data management (PDM) platform and Altium.

TTCI Renews ISO 9001:2015 Certification, Expands Scope to Include X-ray and CT Inspection Services

05/12/2026 | TTCI
The Test Connection, Inc. has successfully renewed its ISO 9001:2015 certification for Test Development and Test Services, with an expanded scope that now includes its X-ray and computed tomography (CT) inspection capabilities.
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