Zhen Ding, Tsinghua University Launch Phase II R&D and Digital Transformation Program

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Zhen Ding Technology Holding Limited, a global leader in the PCB industry, held the launch ceremony for the Phase II (2026-2030) Industry-Academia Collaboration Program of the Zhen Ding-Tsinghua Joint Research Center at the Zhen Ding Technology Lecture Hall on the Tsinghua University campus. The collaboration will focus on key technology and research for advanced PCB and IC substrate, smart manufacturing and industry value chain integration, and talent development. Tsinghua University Vice President Chiu Po-Wen stated that talent is the cornerstone of high-tech industry development and that the University will continue to promote two-way industry-academia talent exchange and deepen collaboration in fundamental research and technology development projects.

The Phase I five-year program of the Zhen Ding-Tsinghua Joint Research Center centered on PCB smart manufacturing and advanced process technologies, driving multiple cross-disciplinary industry-academia R&D projects and field validation. It also established the "Zhen Ding Technology Lecture Series," offering the "PCB Smart Manufacturing Special Topics" course and organizing the PCB Smart Manufacturing Certification Examination, creating a platform for industry-academia research co-creation and talent development. Zhen Ding Technology Group President Chien Chen-Fu also presented a thesis award to Department of Power Mechanical Engineering student Liao Fan-Wei, whose research contributions to the "Design, Testing, and Simulation of Capacitive Pressure Sensors for Robotic Fingers" project led by Professor Lo Cheng-Yao have been published in a top-tier academic journal.

President Chien Chen-Fu stated that Zhen Ding will further strengthen the industry-academia collaboration mechanism and deepen collaborative R&D. By leveraging advanced technology R&D, AI-empowered manufacturing excellence, and strategic talent cultivation, Zhen Ding aims to accelerate the validation of R&D outcomes in real-world production environments and drive the large-scale deployment and application of smart factories. This will advance digital transformation and organizational development in alignment with Zhen Ding's new cycle of rapid growth and global expansion.

To address PCB smart sensing needs and expand high-value product technology requirements, the "Design, Testing, and Simulation of Capacitive and Resistive Pressure Sensors for Robotic Fingers" project, jointly led by Professor Chou He-Hsiu of the Department of Chemical Engineering, Professor Lu Hsiang-Cheng of the Department of Electrical Engineering, and Professor Lo Cheng-Yao of the Department of Power Mechanical Engineering at Tsinghua University, will establish a collaborative R&D platform to strengthen Zhen Ding's positioning in PCB smart sensing. The project will extend into high-value applications, building competitive advantages in innovative fields such as smart robotics, wearable devices, and human-machine interaction.

To enhance manufacturing excellence, the "Advanced Planning and Intelligent Scheduling System" project, jointly led by Professor Wang Hung-Kai of the Cross-College Executive Master's Program in Smart Manufacturing at Tsinghua University and Professor Kuo Hsuan-An of the Department of Computer Science and Information Engineering at National Cheng Kung University, will improve capacity scheduling flexibility and real-time dispatching efficiency. The project aims to enhance resource utilization and on-time delivery rates, strengthen the production line's real-time response capability in the face of demand fluctuations and unexpected disruptions, and boost manufacturing system resilience and overall operational efficiency.

To drive industry value chain integration, the "AOI Root Cause Analysis of Anomalous Defects" project, led by Professor Lai Shang-Hong of the Department of Computer Science at Tsinghua University, focuses on advanced quality control and yield improvement. By enhancing defect identification and anomaly early warning capabilities, the project will help production lines establish more real-time and systematic quality decision-making mechanisms, effectively reducing quality costs and improving process stability and product heterogeneous integration reliability.

President Chien Chen-Fu delivered a keynote speech on "PCB Industry Development Opportunities and Zhen Ding's Global Talent Development," followed by a panel discussion with Group Brand Director Celia Li, Smart Solutions Department Manager Huang Yu-Chieh, and Human Resources Division Deputy Manager Hsu Chun-Ping. The session introduced PCB industry trends, summer internship opportunities, industry-academia collaboration programs, and future career prospects, drawing enthusiastic questions and lively discussion from faculty and students.

Tsinghua University Vice President Chiu Po-Wen (7th from left), Zhen Ding President Chien Chen-Fu (6th from right), and team members at the launch ceremony of the Zhen DingTsinghua Joint Research Center Industry-Academia Collaboration Program.