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Advanced Electronics Packaging Digest

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Mixx Technologies Acquires Sophic Silicon Technologies and Announces Manufacturing Collaboration with Kaynes Semicon

07/23/2026 | PR Newswire
Mixx Technologies, Inc., a US based venture-backed deep-tech company building the interconnect layer for hyperscale AI infrastructure, today announced two simultaneous strategic moves that together mark a defining moment in India's semiconductor journey.

EU Clears €659 Million for German Semiconductor Expansion

07/21/2026 | I-Connect007 Editorial Team
The European Commission has approved €659 million in German state aid for four semiconductor manufacturing projects, continuing Europe's broader effort to strengthen regional semiconductor production and reduce dependence on overseas suppliers.

Sila Secures $300M to Scale U.S. Anode Manufacturing

07/21/2026 | BUSINESS WIRE
Sila, an advanced battery technology company, announced it has secured $300 million in a private equity round led by Atreides Management, and Sutter Hill Ventures.

Tower Semiconductor with METI Support Announces Strategic Capacity Expansion in Japan

07/20/2026 | Tower Semiconductor
Tower Semiconductor, a leading foundry of high-value analog semiconductor solutions, announced a parallel dual-track strategic expansion of its 300mm Silicon Photonics (SiPho), Silicon Germanium (SiGe), and advanced packaging capabilities in Japan, with support from the Government of Japan.

Imec, Diraq Demonstrate First Coherent Operation of 8 Silicon Spin Qubits

07/16/2026 | Imec
Imec, a world-leading research and innovation hub for advanced semiconductor technologies, and Diraq, a pioneer of silicon-based quantum computing, announce they have demonstrated the coherent operation and readout of an eight silicon MOS spin-qubit array designed and fabricated on imec's advanced 300mm spin-qubit technology platform using a CMOS-compatible process.
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