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Indium to Present High-Performance AI Application Solutions at SEMICON SEA 2026
May 1, 2026 | Indium CorporationEstimated reading time: 1 minute
As a leading provider of advanced materials solutions enabling today’s demanding AI applications, Indium Corporation® experts will share their technical insight and knowledge on two industry-critical topics at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
Monday, May 4, 3:45 p.m. MYT
Advanced Materials Science Solutions for Next-Generation AI and Hyperscale Systems presented by Senior Area Technical Manager Kenneth Thum.
This session presents materials innovations to meet rising AI and hyperscale computing challenges. This includes water-washable flux for fine-pitch micro-bumps, Durafuse® LT low-temperature solder to reduce package warpage, and metal thermal interface materials, including Heat-Spring® technology for extreme thermal management. These solutions create a pathway toward higher yields, greater thermal performance, and reliable operation in next-generation semiconductor systems.
Thursday, May 7, 2 p.m. MYT
Reflow and Reliability of InAg Soldering Thermal Interface Material With and Without Flux for TIM1 and TIM1.5 Applications presented by Assistant Product Manager Foo Siang Hooi.
The presentation explores how indium-silver (InAg) solder thermal interface materials can effectively address escalating thermal demands in AI and high-performance computing. Fluxless InAg alloy performance is evaluated through multiple reflow cycles, measuring void formation and reliability under harsh conditions. The research provides critical insights for achieving superior thermal conductivity, low voiding, and enhanced reliability in next-generation CPU, GPU, and AI accelerator packages.
About the Presenters
Kenneth Thum is a senior area technical manager for Indium Corporation and is based in Penang, Malaysia. He assists customers in Southeast Asia by troubleshooting issues and providing technical support for Indium Corporation’s full product range. He has 16 years of experience in electronics assembly.
Foo Siang Hooi is an assistant product manager at Indium Corporation, where he plays a pivotal role in driving business development and expansion of engineered solder products across the Asia region. His responsibilities include delivering technical and commercial training on application technologies and products, and ensuring a comprehensive understanding for clients and stakeholders.
To learn more about Indium Corporation’s high-performance materials solutions, meet with our experts at SEMICON SEA 2026, booth #2269.
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