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From Dilution to ZLD: Optimizing Used Process Water Management

06/10/2026 | Richard Nichols, GreenSource Engineering
Last month, we began discussing the journey from dilution to zero liquid discharge. I highlighted that approximately 70% of the used process water (UPW) is generated from the dilute stream. This significant volume underscores the necessity for effective treatment processes that ensure the safe return of water into the production cycle while minimising environmental impact.

Schneider Electric Launches Uniflair XCA Chiller Line for High-Density AI Data Centers

06/09/2026 | Schneider Electric
Schneider Electric, a global energy technology leader, announced the launch of Uniflair XCA, a new series of air-cooled and free-cooling chillers designed to meet the rapidly evolving demands of AI-driven, high-density liquid-cooled data centers.

Learning with Leo: The Cost of Cleaning and Protecting the Ozone Layer

06/03/2026 | Leo Lambert -- Column: Learning With Leo
I share this perspective based on my experience as a member of the United Nations Environment Programme (UNEP) Solvent, Coatings and Adhesives Technical Options Committee, which developed the report “Protecting the Ozone Layer” to inform policy decisions at the 1995 Meeting of the Parties to the Montreal Protocol in Nairobi. My involvement in this work dates back to 1976, when I joined Digital Equipment as an engineer supporting manufacturing operations, focusing on soldering and cleaning processes across global facilities.

SkyWater Technology Stockholders Approve Merger Agreement with IonQ

05/13/2026 | BUSINESS WIRE
SkyWater Technology, Inc. , the largest exclusively U.S.-based, semiconductor foundry, announced that its stockholders approved at a special meeting held earlier today, the Company’s previously announced merger agreement with IonQ, Inc. (IonQ) for the acquisition of the Company by IonQ.

Sealed for Survival: Potting Electronics for the Toughest Environments

10/29/2025 | Beth Massey, MacDermid Alpha Electronics Solutions
Electronics deployed in harsh conditions face relentless threats from vibration, impact, chemical contaminants, airborne pollutants, and moisture, conditions that can quickly lead to failure without robust protection. Potting, the process of encapsulating electronics in a protective polymer, is a widely used strategy to safeguard devices from both environmental and mechanical hazards.
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