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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Federal Electronics’ Hermosillo Facility Now CSA-Certified for Wire Harness Assemblies
May 13, 2026 | Federal ElectronicsEstimated reading time: 1 minute
Federal Electronics, a leader in providing advanced electronic manufacturing services, announced that its Hermosillo, Mexico facility has been approved to apply the CSA mark to wire harness assemblies. This certification allows Federal Electronics to deliver fully compliant products for North American markets with recognized safety and performance credentials.
The CSA mark confirms that a product has been tested against North American standards and is widely recognized by regulators, Authorities Having Jurisdiction (AHJ), and other agencies across the U.S. and Canada. OEMs relying on CSA-certified products can bring their designs to market with confidence, knowing they meet applicable safety and performance requirements.
“Being able to apply the CSA mark directly at our Hermosillo facility gives our customers a clear, trusted path to market in North America,” said Ed Evangelista, President of Federal Electronics. “It also strengthens our ability to provide consistent, high-quality wire harness assemblies while supporting complex, regulated programs across industries.”
Federal Electronics has been providing cable and wire harness assembly services to OEMs in highly regulated markets—including medical, military and defense, and industrial capital equipment—since 1961. Unlike most EMS providers focused on high-volume, low-complexity production, Federal Electronics specializes in high-mix, low- to mid-volume programs that require engineering expertise and flexible manufacturing.
The Hermosillo facility, established in 2010, employs more than 350 professionals and operates as a nearshore manufacturing hub for OEMs across the U.S. and Mexico. Fully integrated with Federal Electronics’ headquarters in Cranston, Rhode Island, Hermosillo shares centralized IT systems, ERP workflows, and quality controls, ensuring consistent performance across both sites.
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Brent Fischthal - Koh YoungSuggested Items
Road to Reliability: Engineering High Uptime EV Charging Infrastructure
05/13/2026 | Stanton Rak, SF Rak CompanyThe transition to EVs is no longer constrained solely by vehicle capability. Instead, it is increasingly defined by a simpler, but more unforgiving question: Will the charger work when I arrive? This high uptime does not happen by accident. As EV technology has matured, limitations in battery range, power electronics, and thermal management are no longer the primary barriers to adoption.
More Than a Field Trip: Young Students Step into the World of Electronics and Semiconductors
05/13/2026 | Michigan Tech Electronics HubThe energy is electric at Michigan Technological University as 164 fourth graders from Michigan’s western Upper Peninsula trade their traditional desks for a day of high-tech exploration. The students are here to pilot Stories & Semiconductors, a new educational series. By following the adventures of characters who solve problems through electronics, young students don’t just read about technology; they build it themselves.
I-Connect007 Announces Upcoming Issue of Advanced Electronics Packaging Digest
05/13/2026 | I-Connect007The next issue of Advanced Electronics Packaging Digest examines the materials, architectures, and integration strategies shaping the next phase of electronics innovation, from reinforcement materials under thermal and frequency pressure to heterogeneous integration and advanced packaging as a system-level scaling factor.
Indium Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference
05/13/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical industry topics—data center thermal management and sintering protocols—at the SMTA Electronics in Harsh Environments Conference, May 19-21, in Amsterdam, Netherlands.
Green Circuits to Discuss Space-Ready Electronics Manufacturing to Space Tech Expo USA
05/12/2026 | Green CircuitsGreen Circuits, a full-service electronics manufacturing services (EMS) partner to leading OEMs in aerospace and defense, medical and health technology, industrial electronics, and semiconductor and AI hardware markets, will exhibit at Space Tech Expo USA 2026, taking place June 2–4 in Anaheim.