The Marketing Minute: If Your Marketing Budget Gets Cut in Half, Then What?
Punching Out: How Are the Big Boys in Electronics Doing?
It’s Only Common Sense: Complexity Is the Enemy of Profit
Interlink Electronics Reports Q1 2026 Results
May 15, 2026 | Globe NewswireEstimated reading time: 2 minutes
Interlink Electronics, Inc., a global leader in sensor technology and printed electronic solutions, reported results for the first quarter ended March 31, 2026.
Q1 2026 and Recent Highlights
- We recently announced a non-binding letter of intent to acquire an established provider of high-performance manufacturing solutions serving mission-critical sectors such as semiconductor, defense, laser and photonics, commercial high-tech, and aerospace.
- In Q1, revenue grew by 15% year over year, and gross margins improved by 8 percentage points to 43%.
- We are leveraging our expertise in printed electronics to develop electrodes for intelligent test strips used in connected point-of-care and home-testing platforms. As a strategic manufacturing partner for these electrodes, we anticipate the first product will enter clinical trials soon, with initial production later this year, if successful, and significant volume expected in 2027.
- We have begun developing the third generation of a wearable product that uses our proprietary conductive transfer process in an FDA-approved muscle stimulation device. Our technology enhances patient comfort and supports the high success rate of this therapeutic device.
- We plan to launch a new R&D and production facility in South Yorkshire, England at the beginning of July to advance our Conductive Transfer technology for smart textiles and wearable devices.
“I’m excited about our recent commercial momentum and acquisition activity,” said Steven N. Bronson, Chairman, President, and CEO. “We are positioning the business for the next level by capitalizing on our diversified technology offerings, global customers, and footprint.”
Revenue for the first quarter of 2026 increased 15% to $3.07 million, compared to $2.66 million in the first quarter of 2025. The increase was driven by higher shipments of the Company’s force-sensing and printed electronics products, partially offset by lower sales of its gas‑sensor products. Revenues fluctuate periodically in response to changes in customer demand, which can vary with order flow and production cycles, affecting both the timing and volume of shipments.
Gross margin for the first quarter of 2026 was 43.5%, versus 35.6% for the first quarter of last year. The increase was due to higher revenue and changes in the mix of our products and services.
Net loss for the first quarter of 2026 was $338,000, compared to a net loss of $805,000 in same quarter last year. The decrease in net loss was driven by higher revenue and gross profit.
Adjusted EBITDA, a non‑GAAP financial measure, was $(168,000), versus $(623,000) in the prior‑year period.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
SPARK Microsystems Selected for CAD $1M in Government of Canada-backed FABrIC Funding
05/14/2026 | BUSINESS WIRESPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, has been selected by FABrIC as a CAD $1 million grant recipient funded by the Government of Canada.
What Heterogeneous Integration Means for EMS Providers
05/14/2026 | Nolan Johnson, I-Connect007Dr. Ravi Mahajan, an Intel Fellow and Director of Intel’s Technology and Pathfinding group, delivered a keynote at the APEX EXPO 2026 technical conference on using heterogeneous integration (HI) as a strategy and on how advanced packaging technology serves as the technical apex for implementing that strategy. Mahajan’s previous papers and industry presentations on such topics as interconnect density, signal integrity, power delivery, thermal path, and assembly yield as system-level constraints confirm him as an expert on package optimization.
Zhen Ding Reports Record 1Q26 Revenue; Up 1.6% YoY
05/14/2026 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leading PCB manufacturer, announced its consolidated financial results for the first quarter of 2026. First quarter revenue reached NT$40,728 million, up 1.6% YoY and setting a record high for the same period. Net income was NT$2,047 million, and net income attributable to the parent company was NT$1,426 million, with EPS of NT$1.33.
Casimir Launches With $12M Seed Round for Quantum Energy Chip
05/12/2026 | BUSINESS WIRECasimir, Inc., a quantum energy technology company founded by former NASA advanced propulsion researcher Dr. Harold “Sonny” White, today announced the close of a $12 million seed round led by Scout Ventures.
HFR Accelerates GPU-Based AI-RAN Development with ETRI
05/11/2026 | PRNewswireHFR, Inc., a leading telecommunications equipment provider, announced that it has launched the full-scale development of 'AI-RAN,' widely considered the core technology for 6G.