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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Interlink Electronics Reports Q2 2026 Results

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Advanced Electronic Packaging: The Industry's New Innovation Engine

08/13/2026 | Marcy LaRont, I-Connect007
Over the past several years, advanced packaging has moved from the back end of semiconductor manufacturing to becoming one of the electronics industry's most strategic technologies in the ecosystem. At many IEEE conferences, discussions that once centered almost exclusively on transistor scaling now devote equal attention to chiplets, heterogeneous integration, co-design, advanced substrates, thermal management, and system-level packaging.

Understanding Design for Display Electronics

08/12/2026 | Marcy LaRont, I-Connect007 Magazine
For Kristin Moyer, designing display electronics is all about scale. As displays shrink in size and grow in resolution, every engineering decision becomes more demanding. In this interview, the Global Electronics Association design instructor explains the strengths and limitations of today’s dominant display technologies—LCD and LED—as well as the emerging role of AR/VR displays. Kristin also explores the PCB design, manufacturability, and reliability challenges that accompany each.
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