Signal Integrity Meets Additive Innovation in the Latest Issue of I-Connect007 Magazine

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Suggested Items

Thermoreflectance and Solving the Thermal Puzzle in 3D Packaging

06/11/2026 | Marcy LaRont, I-Connect007
Advanced packaging and 3D heterogeneous integration are rapidly redefining the next phase of the semiconductor industry, delivering unprecedented performance gains while posing significant thermal management challenges. In this interview, Dr. Mohammad (Mo) Shakouri, founder and CEO of Microsanj, discusses how thermoreflectance-based metrology is enabling engineers to visualize and measure heat behavior at the nanoscale within complex packages, interposers, and TSV structures.

Three Reasons Manufacturers Are Turning to UV Curable Conformal Coatings

06/11/2026 | I-Connect007
Manufacturers are under increasing pressure to improve reliability while reducing production costs, energy use, and environmental impact. For companies that rely on conformal coatings to protect electronic assemblies from moisture, dust, chemicals, and other environmental hazards, UV-curable technologies are a compelling alternative to traditional coating processes.

Getters, Thermal Management, and High-Reliability Packaging: What’s Ahead in the Next Issue of Advanced Electronics Packaging Digest

06/10/2026 | I-Connect007
The upcoming issue of Advanced Electronics Packaging Digest explores several technologies shaping the future of advanced packaging, from maintaining stable environments inside hermetic packages to managing heat in increasingly complex 3D architectures. The issue also examines packaging innovations for aerospace, defense, and automotive applications, as well as broader connections between semiconductor interconnects and the systems they support.

Elementary, Mr. Watson: Controlled Impedance—When ‘Connecting the Dots’ Stops Working

06/11/2026 | John Watson -- Column: Elementary, Mr. Watson
Signal integrity follows physics that are consistent, predictable, and fully explainable. But those rules don’t show up in the schematic. Instead, they live in the electromagnetic fields around the traces, in the stackup, and in the relationship between conductors and their return paths. The authors weren’t claiming black magic; they were calling out how it feels until you learn what’s going on. The fact that they said it more than 30 years ago only reinforces how fundamental and enduring these concepts really are.

Dan’s Biz Bookshelf: ‘Atomic Habits’

06/03/2026 | Dan Beaulieu -- Column: Dan's Biz Bookshelf
If there’s one business book I recommend more than almost any other, especially to leaders, engineers, and sales professionals trying to get better every single day, it’s Atomic Habits by James Clear. If you’ve already read it, you know this isn’t a book about motivation. It’s not about hype, hustle, or “just try harder.” It’s about something far more practical, and far more powerful: building systems that make success inevitable. That’s what makes Atomic Habits so valuable.