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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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BAE Systems Honors Merlin Flex Ltd with a Partner 2 Win Silver Tier Award
May 18, 2026 | Merlin Flex LtdEstimated reading time: 1 minute
Merlin Flex Ltd announced it received a Silver Tier Award from BAE Systems’ Partner 2 Win program. The award recognizes Merlin Flex Ltd exceptional performance and contributions to the BAE Systems’ Electronic Systems sector supply chain in 2025.
Mark Merifield, Managing Director of Merlin Flex Ltd, confirmed, “This is a great achievement for our company and something that we are all very proud to receive. We have worked with BAE Systems for over 25 years and our whole team are all aware of the importance of performing to the highest standard and the huge impact this has on our customers. We are proud of our high-performance levels and delighted that they have been recognized by receiving this award."
BAE Systems’ Partner 2 Win program drives operational excellence and eliminates inefficiencies in its supply chain by raising the bar of performance expectations to meet the demands of current and future customers. As part of the program, BAE Systems meets regularly with its suppliers to transfer best practices and ensure the components and materials that compose its products meet the highest quality standards.
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BAE Systems Delivers Next-Generation Flight Hardware for U.S. Space Force Missile Warning Program
05/18/2026 | BAE SystemsBAE Systems has delivered the sensor subassembly and sensor system controller components for the Next Generation Overhead Persistent Infrared Polar (NGP) program.
Delta Expands its R&D Capabilities in Soest, Germany with Opening of New R&D Center
05/18/2026 | Delta ElectronicsDelta Electronics (Thailand) Public Company Limited, a global leader in power management and smart green solutions, today announced the official opening of its subsidiary, Delta Energy Systems (Germany) GmbH’s new Research and Development (R&D) center in Soest, Germany, significantly expanding its innovation capabilities in high-efficiency power solutions for AI and High-Performance Computing (HPC) data centers, as well as for electric mobility, including 800 VDC server power supplies and 4-in-1 EV power systems.
Kymeta Joins Red Cat Initiative for Maritime Connectivity
05/15/2026 | Globe NewswireRed Cat Holdings, Inc. , a U.S.-based provider of advanced all-domain drone and robotic solutions for defense and national security, announced that Kymeta, a world-leading flat-panel satellite terminal manufacturer, has joined the Red Cat Futures Initiative, the company’s industry-wide consortium accelerating advanced autonomous systems for modern warfare.
SPARK Microsystems Selected for CAD $1M in Government of Canada-backed FABrIC Funding
05/14/2026 | BUSINESS WIRESPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, has been selected by FABrIC as a CAD $1 million grant recipient funded by the Government of Canada.
Rethinking Reinforcement Materials for Advanced Packaging
05/14/2026 | Ivana Ivanovic, Flexiramics B.V.Materials that once quietly supported the industry are now becoming limiting factors. The electronics industry is experiencing unprecedented pressure as RF systems push into mmWave frequencies, high-speed digital architectures advance into their next performance generation, and power densities climb across automotive, telecom, aerospace, and computing. Reinforcement materials, long treated as a background detail in laminate design, are suddenly at the centre of performance, reliability, and supply‑chain discussions.