Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

MacDermid Alpha Addresses Power Module Reliability Challenges at PCIM Europe 2026

06/01/2026 | MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions will exhibit at PCIM Europe 2026, June 9 - 11 in Nuremberg, Germany, Booth 7-460.

My Trip to Schneider Electric: AI, Data, and the Need for More Power

06/02/2026 | Marcy LaRont, I-Connect007
AI is pushing power infrastructure to its limits, and many of those same challenges, particularly around power delivery and heat management, parallel what the electronics industry faces in building and scaling advanced microelectronics. Yet when it comes to AI and hardware, we typically only see a small piece of the total picture. So, when Schneider Electric invited me to tour a modern AI data center still under construction, I jumped at the opportunity. This became a fascinating technical journey I’m excited to share.

JA Solar Leads Post-Cycle PV Market with Dual-Technology Breakthroughs

06/01/2026 | PRNewswire
JA Solar recently outlined its strategic roadmap for the post‑cycle photovoltaic (PV) market, reaffirming its leadership across TOPCon and BC technologies while advancing toward a fully integrated energy‑solutions model.

MacDermid Alpha Addresses Power Module Reliability Challenges at PCIM Europe 2026

06/01/2026 | MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions will exhibit at PCIM Europe 2026, June 9 - 11 in Nuremberg, Germany, Booth 7-460.

Cadence, Samsung Foundry Deepen 2nm and 3D-IC Collaboration for AI Infrastructure Demand

05/29/2026 | Cadence Design Systems
Cadence and Samsung Foundry announced development of a full portfolio of Memory and Interface IP, and expanded certification of Cadence’s agentic AI digital, custom, 3D‑IC and system design and analysis (SDA) flows for Samsung Foundry’s second-generation 2nm process technology.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in