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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Taiwan's PCB Industry Balances AI Opportunities with Risk Management

06/01/2026 | TPCA
To address the multiple risks arising from the intertwining of geopolitics, sustainable transformation, and the AI wave, the Taiwan Printed Circuit Association (TPCA) established the Sustainability and Risk Governance Committee.

Zhen Ding 2026 AGM: AI Demand Drives PCB Growth and Five-Year Expansion Plan

05/29/2026 | Zhen Ding Technology
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, held its 2026 Annual General Meeting.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/29/2026 | Michelle Te, I-Connect007
This week’s picks all seem to circle around one bigger reality: The electronics industry is rebuilding itself in real time. Whether it’s investing in workforce development, reshaping manufacturing processes, modernizing how we communicate with readers, or strengthening domestic advocacy, there’s a noticeable shift from simply reacting to challenges toward actively building long-term infrastructure.

Nano Dimension Announces Sale of MarkForged to Stratasys

05/27/2026 | Nano Dimension
Nano Dimension Ltd. announced that it has entered into a definitive agreement to sell MarkForged, Inc., a wholly owned subsidiary, to Stratasys Ltd. in an all-cash transaction valued at $42.5 million.

Direct Metallization: A Strategic Enabler for Advanced PCB Manufacturing

05/27/2026 | Carmichael Gugliotti, Director, MacDermid Alpha Electronics Solutions
The increasing power and complexity of electronics systems are intensifying the demands on printed circuit boards and IC substrates. Applications that include AI infrastructure, high-performance computing, electric vehicles, and next-generation consumer electronics require higher interconnect density and uncompromising reliability. At the same time, PCB fabricators are navigating a manufacturing environment shaped by supply chain volatility, sustainability mandates, and ongoing cost constraints.
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