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MKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands Atotech (process chemicals, equipment, software, and services) and ESI (laser systems) will present their latest innovations in advanced packaging, package substrate, and printed circuit board (PCB) manufacturing at the JPCA Show in Tokyo, Japan, from June 10-12. Visitors can meet MKS’ representatives at booth C2-32 and learn more about the company’s latest solutions for advanced electronics manufacturing.
As one of Asia’s leading exhibitions for PCB and electronic packaging technologies, the JPCA Show brings together key domestic and international industry players at a time when the rapid expansion of AI infrastructure, high-performance computing (HPC), and next-generation interconnect architectures is driving demand for increasingly precise manufacturing solutions.
At its booth, MKS will present a comprehensive portfolio spanning precision chemistry, advanced plating systems, laser drilling platforms, optics, motion control, IIoT software, and training services. This integrated offering reflects the company’s proprietary Optimize the InterconnectSM approach and is designed to help customers improve efficiency and process performance across their manufacturing operations.
This approach brings together expertise in lasers, optics, motion, chemistry, and plating systems to help address the evolving challenges of modern electronics production. MKS supports higher precision, improved interconnect performance, and continued miniaturization for next-generation devices by integrating ESI’s laser drilling platforms with Atotech’s chemistry and plating technologies.
Supported by strong local technical expertise, MKS’ Atotech helps its customers improve process yields, streamline manufacturing, and optimize total cost of ownership.
A broad range of advanced process and equipment solutions will be featured, including:
Chemical process highlights:
- Printoganth® MV TP3 series: Adaptable electroless copper for advanced packaging applications
- Cupraganth® MV: copper-based activation system for advanced packaging applications
- NovaBond® EX-S2: Differential etching solution designed for advanced package substrates, enabling precise material removal in SAP manufacturing
- EcoFlash® S 300 U: Differential etching for advanced SAP manufacturing
- InPro® SAP7: Next-gen VCP pattern BMV filling with excellent within-unit distribution at high CDs
- InPro® Pulse TGV: Advanced copper filling for high-aspect-ratio through-glass vias
- Stanna®-Flex: Tin finish for flexible substrates offering mild plating properties, high material compatibility, and excellent fine line performance
Equipment solutions include:
- G-Plate®: Vertical desmear and electroless HVM plating tool for next-generation high-end package substrates with optimized particle control
- vPlate®: vertical conveyor plating equipment for next-generation
- HDI PCB and package substrates
- CapstoneTM: Flex PCB UV drilling tool for high-performance breakthrough productivity
- 5335™ flex PCB laser drill: Best-in-class high-volume FPC laser drilling machine for flexible PCB manufacturing
- Geode™ platform solutions: Next-generation PCB and advanced substrate CO2 and UV laser via drills
