Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Samsung Electronics, ASML Expand Semiconductor Collaboration

09/10/2026 | BUSINESS WIRE
Samsung Electronics and ASML announced an expansion of their long-standing strategic partnership, deepening collaboration on High NA EUV lithography and advanced semiconductor manufacturing technologies that will help drive the next generation of innovation in the AI era.

Semiconductor Design Market to Reach $69.43B by 2035

09/10/2026 | Globe Newswire
According to SNS Insider, the global Semiconductor Design Market was valued at $25.23 Billion in 2025 and is projected to reach USD 69.43 Billion by 2035, registering a CAGR of 10.67% from 2026 to 2035.

Early Purchases Lift 2026 Smartphone Production Forecast to 1.07 Billion Units

09/09/2026 | TrendForce
Global smartphone production reached 275 million units in 2Q26, down 8% YoY, according to TrendForce’s latest smartphone industry research.

Follow the Story: AI Reshapes the Electronics Supply Chain

09/09/2026 | Michelle Te, I-Connect007
The AI infrastructure boom is creating enormous opportunities for electronics manufacturers, but its effects are spreading well beyond companies building AI servers and data centers. High performance laminates, glass fabric, copper, memory, MLCCs, foundry capacity, and other critical resources are being pulled toward fast-growing AI applications, tightening supplies and pushing up costs elsewhere in the electronics industry. I-Connect007 has been following these developments from several directions. What initially looked like separate stories about laminate availability, memory prices, component demand, PCB capacity, and data-center growth are demonstrating how AI is changing how the electronics supply chain allocates materials, capacity, and investment.

GlobalFoundries, RAAAM Develop Next-Gen GCRAM on FDX Platform

09/02/2026 | GlobalFoundries
GlobalFoundries (GF) and RAAAM Memory Technologies, a pioneer in advanced on-chip memory solutions, announced a strategic collaboration to develop and qualify Gain-Cell RAM (GCRAM) technology.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in