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Advanced Electronics Packaging Digest

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Suggested Items

CEA-Leti, GlobalFoundries Advance European FD-SOI Innovation via FAMES Pilot Line

06/11/2026 | CEA-Leti
CEA‑Leti, a leading European research institute for microelectronics, reaffirmed its long‑standing collaboration with GlobalFoundries (GF), whose ongoing participation in the FAMES Pilot Line as an end user is advancing more than two decades of joint work on fully depleted silicon‑on‑insulator (FD‑SOI) technology and reinforcing Europe's leadership in energy‑efficient, sovereign semiconductors.

Airbus Defence and Space Forms Sovereign Space Intelligence Consortium

06/10/2026 | Airbus Defence and Space
Airbus Defence and Space has signed a Memorandum of Understanding with Rohde & Schwarz, constellr, Orbint and High Performance Space Structure Systems (HPS) to collaborate on a satellite-based Earth observation and Intelligence, Surveillance, and Reconnaissance (ISR) solution.

GlobalFoundries, Qualinx Demonstrate First European Sovereign Chip Manufacturing Flow

06/10/2026 | BUSINESS WIRE
GlobalFoundries (GF) and Qualinx announced the successful completion of the first fully European-based, end-to-end semiconductor manufacturing flow at GlobalFoundries’ Dresden fab on its FDX technology.

EC Unveils Chips Act 2.0 at SEMI Europe Forum to Boost Semiconductor Innovation

06/04/2026 | SEMI
The European Commission officially presented the new European Chips Act 2.0, marking a major step forward in Europe’s ambition to strengthen its semiconductor competitiveness, resilience and technological sovereignty.

Global Electronics Association Commends the European Commission for Strengthening Technological Sovereignty by Proposing the Chips Act 2.0

06/04/2026 | Global Electronics Association
The Global Electronics Association applauds the European Commission on releasing the Chips Act 2.0 as a critical part of the Technological Sovereignty Package.
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