Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

TSMC and Amkor Technology Announce Long Term Partnership to Accelerate Advanced Packaging in the US

06/16/2026 | BUSINESS WIRE
Taiwan Semiconductor Manufacturing Company and Amkor Technology, Inc. announced a 10-year agreement to foster a strong partnership that will enhance advanced semiconductor packaging capabilities in Arizona, strengthening and accelerating investment in the U.S. semiconductor supply chain ecosystem.

SEMICON Taiwan 2026 to Serve as Global Stage Where the Semiconductor Industry Defines What’s Next

06/16/2026 | SEMI
SEMICON Taiwan 2026, one of the global semiconductor industry’s flagship annual events, will be held September 2-4 at the Nangang Exhibition Center in Taipei, with forums beginning on August 31 to align with International Semiconductor Week.

Spirit Electronics Opens U.S. Semiconductor Manufacturing Access for Aerospace and Defense

06/15/2026 | Globe Newswire
Spirit Electronics announced a new managed-access offering that provides aerospace and defense customers with a secure pathway to advanced, U.S.-based semiconductor manufacturing in 28nm CMOS.

SEMI 3D & Systems Summit to Highlight Heterogeneous Integration for Europe's Semiconductor Future

06/15/2026 | SEMI
The SEMI 3D & Systems Summit, taking place June 17–19, 2026 in Dresden, will bring together the world’s foremost experts in advanced semiconductor packaging and heterogeneous systems integration.

AT&S Expands Kulim Site to Meet Customer Demand, Strengthen Tech Partnerships

06/15/2026 | AT&S
AT&S announced the expansion of its Kulim manufacturing site, based on agreements with its customer AMD and another leading technology company.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in