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Below the Surface: Why Thermal Failure Is Still the No. 1 Killer in Power Electronics

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Why do power electronics fail? There’s a range of answers, from overvoltage and mechanical stress to poor assembly and environmental exposure. If you ask your favorite AI search engine for an answer, you’ll get a pretty simple response: excessive temperature leads to component degradation, material breakdown, and eventual failure. In a sense, that’s true, but it’s oversimplified and incomplete. The real issue is thermal management failure at the system level. Heat is still the number one killer, and most of the time, you don’t even realize it’s there.

Ventec’s Glass-Free Revolution: Smarter Material Data for Next-Gen PCB Designs

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At Ventec, we’re excited to see our Glass-Free Bondply materials now included in the latest release of Polar Instruments’ Speedstack.

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Your AI Doesn't Know Your Process (Here's How to Teach It)

08/13/2026 | Sean Patterson, CrossGen AI
Last month, I made the case that you should not buy AI in the hope that it will fix the business. You need to learn it yourself first. If your AI is failing, it’s not because it is lazy or broken. It is failing because it does not know your plant. It does not know your quoting rules, how material gets released to the floor, what your customer expects in an 8D1, or which spec outranks another. It certainly does not know where your team hides the real answer once the formal procedure and reality have drifted apart.

Polar's Speedstack Eases Material Identification and Adds Ventec Glass-Free Materials

08/10/2026 | Polar Instruments
Polar’s Speedstack mid-year release adds Ventec Glass-Free materials to online resources, and incorporates improved capability of identifying multi material families in the stack documentation, giving users “at a glance” visual views of material types in a stack.
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