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Advanced Electronics Packaging Digest

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Suggested Items

Nokia Announces Major Expansion of U.S. Semiconductor Advanced Test and Packaging in Pennsylvania to Bolster AI Growth

06/24/2026 | Nokia
Nokia announced a major expansion of its advanced test and packaging (ATP) operations in Allentown, Pennsylvania. The investment will increase domestic production capacity of the optical networking technologies that power scalable AI infrastructure connectivity across the United States.

Dell AI Factory with NVIDIA Advances Supercomputing-Class Infrastructure

06/22/2026 | BUSINESS WIRE
Dell Technologies introduces the Dell PowerEdge XE8812 server, a new addition to the Dell AI Factory with NVIDIA, purpose-built for the world's most demanding HPC and AI workloads, featuring NVIDIA Vera Rubin NVL4 architecture and delivering up to 144 GPUs per rack.

Saab Receives Prder for Giraffe 1X Radars from Denmark

06/19/2026 | Saab
Ahead of the EU leaders' security summits in Copenhagen in October 2025, the Danish Armed Forces engaged Saab to deploy several Giraffe 1X systems for surveying both civil and military infrastructure.

Kingboard Raises $1.5 Billion Through Kingboard Laminates Stake Sale to Support PCB Expansion

06/17/2026 | I-Connect007 Editorial Team
Kingboard Holdings has raised approximately HK$11.77 billion (US$1.5 billion) through the sale of a portion of its stake in subsidiary Kingboard Laminates Holdings, as growing demand from AI infrastructure drives investment across the PCB and electronics materials supply chain.

SCHMID Group Records More than €26 Million Order Intake since Mid-May

06/16/2026 | Globe Newswire
SCHMID Group announces a strong combined order intake of more than €26 million since mid-May 2026, reflecting multiple customer orders and continued market momentum in advanced PCB and substrate manufacturing technologies for AI infrastructure and next-generation optical module supply chains.
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