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Hosted by IMAPS and Global Electronics Association, the Onshoring Advanced Packaging Workshop will be held Aug 31 - Sep 2, 2026, bringing together the U.S. Government, DIB (Defense Industrial Base), and key stakeholders to drive microelectronics packaging and assembly onshoring.
Discover emerging government‑led advanced packaging initiatives and collaborate with suppliers, researchers, and integrators to strengthen the advanced packaging supply‑chain onshoring ecosystem in America.
The mission of this workshop is to engage our workforce community to identify the newly created advanced packaging programs which address US government and defense requirements critical to the onshoring of the microelectronic assembly and packaging supply chain. Government agencies including the Department of Commerce/NIST, DoD (SHIP/IBAS/Title III), and DARPA will be briefing on their advanced packaging programs.
Additional information and registration can be found on the IMAPS website.
