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The Call for Participation is now open for the Advanced Electronic Packaging Conference (AEPC) 2027 – Component-to-System-Level Integration – taking place during APEX EXPO 2027 in Anaheim, California. AEPC is the electronics industry’s premier technical conference for component-to-system-level integration, advanced PCB and assembly manufacturing, and next-generation electronics technologies. The Global Electronics Association invites engineers, researchers, manufacturers, and technology leaders from around the world to submit technical presentation abstracts for this distinguished event.
AEPC 2027 brings together the brightest minds across the electronics ecosystem to share peer-reviewed technical content, practical solutions, and emerging technologies that are advancing the industry. The conference serves as a vital platform for exchanging innovations that span electronics design, materials, assembly and test, reliability, manufacturing, and system integration.
Presenting at AEPC 2027 offers speakers a unique opportunity to showcase their work to a global audience of engineers, researchers, manufacturers, and technology decision-makers. Selected speakers gain industry recognition, valuable peer feedback, opportunities to build new professional connections, and the chance to influence the future direction of electronics packaging, manufacturing, and system integration.
AEPC 2026 attracted more than 170 conference participants from 20 countries and featured 78 peer-reviewed technical papers representing over 100 companies, universities, and research organizations, demonstrating the conference's role as a leading forum for technical exchange and industry collaboration.
The Association seeks abstract proposals for:
- Technical Presentations that demonstrate innovation, practical application, and measurable industry impact
- Technical Posters showcasing emerging research and applied solutions
- Professional Development Courses that advance the knowledge and skills of industry professionals
Submissions are encouraged across the full spectrum of electronics design, materials, assemblyand test, reliability, manufacturing, and system integration.
Submission Deadlines
Technical Presentations: September 18, 2026
Professional Development Courses: September 18, 2026
Technical Posters: December 4, 2026
Shape the Future of Electronics
"AEPC 2027 offers an unparalleled opportunity to contribute to the advancement of electronics technology and manufacturing," said Matt Kelly, Conference General Chair and CTO, VP, standards and technology solutions at the Global Electronics Association. "We invite innovators from around the world to share their work and help shape the future of our industry."
Prospective participants can view conference technical topics and submission requirements and submit their proposals at https://www.apexexpo.org/event-info/call-participation
About the Advanced Electronic Packaging Conference (AEPC) – Component-to-System-Level Integration
The Advanced Electronic Packaging Conference (AEPC) is a premier technical forum dedicated to advancing electronics packaging and system integration. Held during APEX EXPO, AEPC unites engineers, researchers, manufacturers, and technology leaders to exchange peer-reviewed research, practical solutions, and emerging technologies driving the future of the electronics industry.
Conference sessions: April 5-7, 2027
Professional Development courses: April 4, 5, and 8, 2027
Posters available on the APEX EXPO show floor: April 6-8, 2027
