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Nordson EFD to Preview New Dispensing Technologies for Medical Device Assembly at COMPAMED 2026

11/06/2026 | Nordson
Nordson EFD, a Nordson company, announced that trade show attendees will get the first look at two new dispensing technologies, the Ultimus AccuFlow™ and PICO Pµlse® XP HV, at COMPAMED 2026, November 16–19 at the Düsseldorf Exhibition Centre in Düsseldorf, Germany.

Finetech Expands Volume Production Portfolio, Appoints André Thiemann Co-CEO

11/06/2026 | Finetech
Finetech, a supplier of high-precision die bonding systems for advanced packaging and heterogeneous integration, is expanding its management team: André Thiemann became Co-CEO on November 1.

Applied Materials to Increase its Strategic Investment in BE Semiconductor Industries

11/06/2026 | Applied Materials
 Applied Materials, Inc. announced it is increasing its investment in BE Semiconductor Industries N.V. (Besi), a leading manufacturer of assembly equipment for the semiconductor industry, to approximately 20 percent of Besi’s outstanding shares. The share purchase would add to Applied Materials’ current investment in Besi, which Applied initially made in April 2025.

Curtiss-Wright Wins $225M+ in U.S. Navy Contracts

11/06/2026 | BUSINESS WIRE
Curtiss-Wright Corporation announced it was awarded contracts valued in excess of $225 million by Bechtel Plant Machinery, Inc. (BPMI) to provide advanced propulsion valves, pumps and instrumentation and control systems for the U.S. Navy’s Virginia-class nuclear powered attack submarine, Columbia-class submarine and Ford-class aircraft carrier programs.

IPC K-FEST 2026 Brings AI, Manufacturing and Standards into Focus

11/06/2026 | Global Electronics Association
Organized by the Global Electronics Association with support from Korea Testing Laboratory (KTL), the fourth IPC Korea Festival of Electronics Standards and Technology (IPC K-FEST 2026) took place in Seoul on November 3.
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