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Will Your Vias Survive the Heat? New Book From I-Connect007 Has the Answers

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I-Connect007 is excited to announce the release of The Printed Circuit Assembler's Guide to... Via Structures: Reflow Process Survivability, Reliability, and Robustness, the newest title in its technical resources library. Written by reliability expert Bob Neves, the book examines one of the industry's most misunderstood topics: how to properly evaluate PCB via structures for assembly process survivability, long-term reliability, and robustness.
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