American Made Advocacy: American PCBs in Big Demand and Short Supply
Defense Speak Interpreted: Will Defense Become a Totally New Supplier for Drone Electronics?
The Right Approach: The End of an Era—DoD Proposes MIL-PRF-31032 Cancellation
ASMPT SMT Solutions will exhibit at the first EFX Expo for Electronics Manufacturing in Stuttgart, Germany. From October 6 to 8, the global technology and market leader for integrated hardware and software solutions for the electronics manufacturing industry will present its latest products and services for intelligent SMT production at Booth 9D52 in Hall 9. The focus will be on innovations around the new SIPLACE V assembly platform, the DEK TQ L stencil printer, and the WORKS Software Suite for connecting and optimizing workflows on the shop floor.
“With its focus on personal interactions and networking, the EFX provides an ideal supplement to the Productronica by creating a new meeting place for electronics manufacturers every two years,” explained Bernhard Fritz, Head of Global Marketing, ASMPT SMT Solutions. “AI applications are currently changing the requirements for electronics manufacturing faster than ever before. The EFX presents an ideal platform for discussing with customers and partners how integrated hardware and software solutions help companies to respond flexibly to these developments and prepare their factories for the future.”
SIPLACE V L: Ready for demanding AI server boards
With the SIPLACE V, ASMPT has developed a new generation of placement machines that enables productivity increases of up to 30 percent under real-life conditions in several key industries while also meeting the rising requirements of modern electronics applications, such as AI server boards. It can handle large and heavy high-performance BGAs, oversized circuit boards and highly miniaturized components down to the 016008M size factor reliably, precisely, and efficiently.
At EFX, ASMPT will demonstrate with the SIPLACE V L how maximum productivity and quality can be combined with outstanding flexibility. With a compact footprint of just 1.5 × 2.4 m, the placement platform processes odd-shaped components (OSCs) up to 55 mm in height. Existing SIPLACE X feeders and even changeover tables from the SIPLACE SX can continue to be used, providing electronics manufacturers with a high level of investment protection. An enhanced Smart Pin Support, increased maximum PCB size and a flexibly interchangeable tray changer further expand application versatility and simplify adaptation to changing production requirements.
Top productivity and quality in solder paste printing
With the DEK TQ L, ASMPT will present its stencil printer for mid-size boards that has been designed from the ground up for productivity, precision and automation. It combines maximum precision (up to ±17.0 µm @ 2 cpk wet-print accuracy) with a core cycle time of only 6.5 seconds. Many automation functions increase the machine’s productivity and process reliability. The understencil cleaning system runs for a whole shift without any user assists, the Dual Access Cover makes it possible to switch out paste cartridges without having to stop the machine, and Automated Paste Transfer can transfer the paste to a new stencil completely on its own. A new mechanism cuts the time required to change squeegees by up to 20 percent. And with the DEK TQ GO, even squeegee and stencil changeovers can be fully automated in the future.
With WORKS Automation, ASMPT will show how printing processes can be automatically optimized even further. The software continuously captures and analyzes process data from the printer and the SPI system, recognizes potential improvements, and helps with intelligent and increasingly AI-supported functions to improve print quality, process stability, and productivity.
Intelligent use of data
With the WORKS Software Suite, ASMPT will showcase its integrated software platform for intelligent SMT manufacturing. It connects machines, processes and production data in real time to create total production transparency. Based on this information, users can optimize specific workflows, deploy resources more efficiently, and make decisions more quickly. The WORKS applications support all workflows on the shop floor in terms of material management, process optimization along the SMT line, and efficient personnel deployment. Thanks to open interfaces according to industry standards IPC-HERMES-9852 and IPC-CFX, users can easily integrate machines, software solutions and autonomous mobile robots (AMRs) from other manufacturers and build a coordinated manufacturing environment.
