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Built for What’s Next: The End of Flat Thinking

11/05/2026 | Michael Gleason -- Column: Built for What’s Next
Advanced PCB design increasingly brings electrical performance, thermal behavior, mechanical requirements, material selection, and manufacturability into the same conversation. The board sits within a larger physical system, and each decision can influence how that system performs. Looking at those relationships together creates more opportunity to optimize the design as a whole.

SIA Urges Senate to Pass Bipartisan Permitting Reform Legislation to Boost U.S. Competitiveness

11/05/2026 | SIA
The Semiconductor Industry Association (SIA) released the following statement from President and CEO Michael Robbins calling for congressional passage of the Bipartisan American Affordability and Jobs Act of 2026 (S. 5653), legislation that would reinforce U.S. competitiveness and boost domestic semiconductor production and innovation by streamlining federal permitting and environmental reviews.

I-Connect007 Releases Episode 5 of ‘On the Line With… Qnity: Engineering What’s Next’ Podcast Series

11/04/2026 | I-Connect007
I-Connect007 announces the release of the fifth episode in its six-part podcast series, On the Line With… Qnity: Engineering What’s Next. This latest installment, titled “Engineering Heat Out of High-Power Systems,” examines the increasingly critical role of thermal management in electronics design and how innovative materials are enabling higher performance, greater reliability, and improved safety.

Ventec to Showcase Advanced PCB Materials at electronica 2026

11/02/2026 | Ventec International Group
At electronica 2026, Ventec International Group will present advanced material solutions for designers working at the boundaries of high-speed signal integrity, thermal management and physical space constraints.

indie Selected for Space-Qualified Satellite Program

11/02/2026 | indie Semiconductor
indie Semiconductor, an automotive solutions innovator, today announced that superluminescent light-emitting diodes (SLEDs) from its photonics portfolio have completed final space qualification testing and have been selected for use in the Copernicus Hyperspectral Imaging Mission for the Environment (CHIME)
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