Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

Advanced Electronic Packaging: The Industry's New Innovation Engine

08/13/2026 | Marcy LaRont, I-Connect007
Over the past several years, advanced packaging has moved from the back end of semiconductor manufacturing to becoming one of the electronics industry's most strategic technologies in the ecosystem. At many IEEE conferences, discussions that once centered almost exclusively on transistor scaling now devote equal attention to chiplets, heterogeneous integration, co-design, advanced substrates, thermal management, and system-level packaging.

More Than Moore Enabled by Advanced Packaging and Heterogeneous Integration

08/13/2026 | Chetan Arvind Patil, Marvell Technology
For more than a half-century, Moore's Law has been the defining principle of semiconductor innovation. By continually shrinking transistor dimensions, the semiconductor industry delivered exponential improvements in computing performance, energy efficiency, and integration density. Each new technology node enabled more transistors to be placed on a single die, reducing the cost per transistor and making electronic systems smaller, faster, and more capable. Though this scaling continues to advance, it is no longer the sole driver of system-level innovation, which now increasingly comes from a combination of scaling and advanced packaging.

Sony Semiconductor Solutions and TSMC Agreed to Establish Joint Venture for Next-Generation

08/11/2026 | TSMC
Sony Semiconductor Solutions Corporation and Taiwan Semiconductor Manufacturing Company Limited (TSMC) announced the execution of a legally binding definitive agreement for the establishment of Advanced Vision Semiconductor Manufacturing Corporation as a joint venture (JV) in Koshi City, Kumamoto Prefecture, Japan.

ESIA Reports Strong Momentum in Global Semiconductor Sales in Q2 2026

08/11/2026 | ESIA
The European Semiconductor Industry Association (ESIA) announced that strong momentum in global semiconductor sales continued into the second quarter of 2026, with worldwide sales surging 123.6% year over year (YoY) to US$403.3 billion.

Advanced Chip Packaging Technologies Market to Reach $87.6 Billion by 2030

08/11/2026 | Globe Newswire
The global advanced chip packaging technologies market is projected to grow from $38.6 billion in 2024 to $87.6 billion by 2030, at a compound annual growth rate (CAGR) of 14.8% over the forecast period.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in