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When the World Becomes Your Design Team

09/24/2026 | Stephen V. Chavez, Siemens EDA and PCEA
More than a decade ago, I stood in front of an IPC APEX EXPO Design Forum audience and talked about something that was becoming more important in electronics design: successful communication with an international engineering team. I had been working with a global PCB design organization that included a talented team in Bangalore, India. However, I was based in Arizona, where there was a 12-hour time difference separating us. With different work schedules, cultures, languages, and communication styles, there were plenty of reasons that could have made collaboration difficult.

Follow the Story: Building the Hardware Behind AI

09/24/2026 | Michelle Te, I-Connect007
When TTM opened its new UHDI facility in New York earlier this year, it wasn't simply adding another PCB factory. As the largest circuit board builder in the United States, TTM was investing in technologies that bring PCB fabrication closer to the complex world of semiconductor packaging. The advent of AI helps explain why that matters. The enormous compute power required by AI is pushing chip performance to new levels, but those chips don't operate in isolation.

Catching Up With PCB Technologies’ Issey Ende

09/24/2026 | Dan Beaulieu, D.B. Management Group
There are certain conversations you walk away from knowing you’ve just spoken with someone who truly understands where the electronics industry is headed. That was exactly my experience talking with PCB Technologies executive Issey Ende. I was impressed by Issey’s deep understanding of what customers need. He speaks with the perspective of someone who has spent decades inside the industry, watching the transformation of PCB manufacturing into a highly complex global technology infrastructure.

FKN Systek Introduces S300 Multiple-Blade PCB Depaneling Saw

09/23/2026 | FKN Systek
FKN Systek now offers the S300 multiple-blade depaneling saw for singulating assembled PCBs. The saw uses a 2.95-inch (75 mm) diameter, 0.021-inch-thick diamond-coated cutting blade.

3 Key Takeaways from The Printed Circuit Assembler's Guide to... Via Structures: Reflow Process Survivability, Reliability, and Robustness

09/22/2026 | I-Connect007
As PCB technology has evolved, the structures being evaluated become more complex. But have the methods used to determine their reliability evolved at the same pace? In The Printed Circuit Assembler's Guide to... Via Structures: Reflow Process Survivability, Reliability, and Robustness, Bob Neves challenges some long-held assumptions about how the electronics industry evaluates PCB via structures. He draws on decades of reliability experience, and examines not only how we test, but what those tests actually tell us.
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