FKN Systek Introduces Two-Stage Depaneling for Thin Aluminum Panels

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Single-step, double-blade depanelization of thin, V-scored aluminum panels can cause warping, especially in longer lengths. This is due to the stress induced by the shearing action.

FKN Systek’s K2020 eliminates this issue by employing a two-stage process. The first set of tandem double circular blades precisely reduces material along the score line. The second set then cleanly shears the panel, minimizing stress and preventing the “potato chip” effect.

Unlike standard FR4 depaneling, which separates panels in a single pass with a paper-thin blade gap, aluminum requires a shearing action that, when done in one step, introduces warping.

The K2020’s two-stage approach also benefits FR4 panels with sensitive components near the score line by minimizing stress.

How It Works: The scored PCB panel is placed on the lower blade guard and advanced to the first set of blades (set to a paper-thin gap) for material reduction. The panel then moves to the second set of blades for the final shear separation. The adjustable upper blade guard ensures accurate alignment along the score line.