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Fraunhofer IPMS Develops Wafer-Level High-Density Chiplet Systems

05/20/2026 | Fraunhofer IPMS
Breakthrough in chip manufacturing: As part of the European APECS pilot line, researchers at Fraunhofer Institute for Photonic Microsystems IPMS have developed a method that allows different chip components to be fused almost seamlessly into a single unit.

€15M AI-DISCO Project Launches as First Module of AI & Microelectronics Research Factory

03/09/2026 | Fraunhofer IPMS
The Federal Ministry of Research, Technology, and Space (BMFTR) has approved €15 million in funding for the AI-DISCO project – Edge/Cloud AI for Distributed Sensing & Computing.

Fraunhofer IPMS Adds Ultratrace Elemental Analysis for Wafers

03/06/2026 | Fraunhofer IPMS
The Fraunhofer Institute for Photonic Microsystems IPMS is expanding its analytical capabilities in the field of wafer contamination.

New Fraunhofer IPMS Chip Makes pH Measurements Easier and Devices More Robust and Portable

02/19/2026 | Fraunhofer
Fraunhofer Institute for Photonic Microsystems IPMS has achieved another breakthrough in pH measurement technology.

Fraunhofer IPMS Develops Next-Gen Optoelectronic Sensors in OASYS Project

12/05/2025 | Fraunhofer
In the OASYS joint project, Optoelectronic Sensors for Application-Oriented Systems for Life Sciences and Intelligent Manufacturing, Fraunhofer Institute for Photonic Microsystems IPMS is collaborating with research and industry partners to develop state-of-the-art optoelectronic sensor technologies.
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