Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

FIT Tech Day 2026 Highlights Optical Connectivity for AI Data Centers

09/18/2026 | Foxconn
FIT Hon Teng, a subsidiary of Foxconn Technology Group, kicked off its "FIT Tech Day 2026". Themed "Light at Scale:

FSQuality Circuits to Showcase Advanced PCB Manufacturing Capabilities at PCB West 2026

09/18/2026 | FSQuality Circuits
FSQuality Circuits (FQC), a leading Thailand-based manufacturer of advanced printed circuit boards, will exhibit at PCB West 2026, taking place September 29 through October 2 at the Santa Clara Convention Center in Santa Clara, California.

CoWoS-L to Remain Mainstream AI Chip Packaging Solution Through 2028

09/18/2026 | TrendForce
TrendForce’s latest research into advanced semiconductor packaging reveals that GPU suppliers and hyperscale CSPs are continuing to develop increasingly powerful and versatile AI chips, making larger package sizes a key development priority for 2.5D packaging.

BAE Systems Receives $16M to Qualify RH45® for Space Missions

09/17/2026 | PRNewswire
BAE Systems has received $16 million in Defense Production Act Title III funding via the Department of War's (DOW) Warfighting Investments, Resourcing, and Execution directorate to demonstrate and qualify its radiation-hardened 45 nanometer (nm) technology.

STARTEAM GLOBAL Joins IPAI to Advance AI Innovation in PCB Manufacturing

09/16/2026 | STARTEAM GLOBAL
We are pleased to announce that STARTEAM GLOBAL has joined IPAI (Innovation Park Artificial Intelligence), one of Europe’s leading AI innovation hubs dedicated to accelerating the practical application of AI across industries.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in