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Linde to Invest $1 Billion to Support Major U.S. Semiconductor Facility Expansion

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Knocking Down the Bone Pile: X-ray Inspection of Ball Grid Array Solder Joints

08/07/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Ball grid array (BGA) devices are ubiquitous in electronic products primarily due to their advantages, including compact packaging, greater durability than leaded devices, and improved performance from shorter signal paths. BGAs improve electrical performance by reducing inductance and capacitance between the internal silicon die and the PCB, resulting in superior signal integrity and faster operation speeds. BGAs also offer superior thermal performance by dissipating heat more effectively, reducing the risk of overheating.

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Getters for Hermetic Packages: Mechanisms, Reliability Impact, and MacDermid Alpha Electronics Solutions

06/11/2026 | Michael Previti, MacDermid Alpha Electronics Solutions
Hermetic packages protect chips, lasers, and sensors from the outside world, but the cavity inside can still change after seal. Small amounts of water, hydrogen, carbon dioxide, and organic vapor may remain after build or may form later from adhesives, films, and other internal materials. Getters reduce that risk by creating a planned sink for those gases inside the package. When teams choose the right getter early, they hold the headspace steady, cut reliability escapes, and lower the life-cycle cost of a high-value device.

BEST Inc. Publishes Optimizing BGA Rework Techniques to Ensure Quality Tech Paper

04/15/2026 | BEST Inc.
BEST Inc., a leader in electronic component and PCB services, is pleased to announce they have published a tech paper describing techniques for reworking BGA components to ensure quality during the printed circuit board rework process.
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