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3 Key Takeaways: Understanding the Promise and Practical Limits of ELIC

10/26/2026 | I-Connect007
As semiconductor packages become smaller and more complex, PCB designers face increasing pressure to accommodate higher interconnect densities within tighter space constraints. Every layer interconnect (ELIC) technology offers a way to overcome some of the limitations of traditional HDI construction, but achieving greater density introduces new challenges in fabrication, reliability, and cost. In his white paper, ELIC: Every Layer Interconnect—The Promise, the Pain, and the Practical Limits, ASC President and CEO Anaya Vardya examines the advantages of ELIC architecture, the manufacturing challenges that accompany it, and the design decisions that determine whether a board can be produced reliably at scale.

The Fearless Connector: Why I Chose the Hard Road

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Rehm Thermal Systems Readies for SMTA Guadalajara

09/23/2026 | Nolan Johnson, I-Connect007
In this interview, Nolan Johnson speaks with Rehm Mexico General Manager Luis Garcia about the growing electronics manufacturing market in Mexico, renewed investment in production equipment, and increasing demand driven by AI, automotive, electromobility, and medical applications. Garcia also discusses Rehm’s expanding technology portfolio and what the company will showcase at SMTA Guadalajara.
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