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WIN Semiconductors Corp, the world's largest pure-play compound semiconductor foundry, announced the addition of Orlando, Florida-based SawStreet LLC to the WIN Alliance Partner Program. The partnership complements WIN's in-house backend processes, giving customers another trusted partner for wafer grinding and thinning, dicing, pick-and-place and die inspection.
SawStreet handles thicknesses as low as 50 µm, and specializes in wafer grinding and thinning, including dice-before-grind (DBG), along with precision dicing, high-speed pick & place, and visual die inspection to MIL-STD-883 Condition A or B, or to customer internal specifications.
“We are pleased to be invited into the WIN Alliance,” said Jim Young, President and CEO of SawStreet LLC. “SawStreet has spent years handling GaAs, GaN and InP wafers for demanding commercial, defense and space programs, and we understand how much value sits on a single wafer by the time it leaves a fab like WIN's. Joining the Alliance gives WIN customers a U.S.-based partner for backend processing, with the quick-turn schedules and handling discipline those programs require.”
Russ Wagner, Vice President of Business Development for WIN Semiconductors, commented, “Adding SawStreet to the WIN Alliance gives our customers an alternate backend processing option that complements the services WIN already provides. Their expertise adds another layer of support for customers looking to reduce overall wafer processing cycle time.”
